-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
EIPC Winter Conference Lyon, France 2023 Calls for Registration
December 9, 2022 | EIPCEstimated reading time: 1 minute
France is evocative of many things, amongst them some classics: their cuisine, their architecture, their music. In the latter category, who has not heard the timeless “Songs from the Auvergne” by Joseph Canteloube. Who has not been to Lyon, in the Auvergne Region?
If you wish to part of another classic event, then please consider joining the EIPC Winter Conference which is to be held over two days the first in the famous Grouparna Football Stadium in Lyon, wherein The Kopster Hotel will be our overnight stay venue; the second will be at the Bugey Nuclear Power Plant. In the evening of the first day we shall be dining, rather well, downtown Lyon centre.
The conference will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, ASS Luippold, Dyconex, Suss MicroTec, Showa Denko, NanYa and others. We will also be having a Round table for environmental matters e.g. REACH SVHC solder mask restrictions, involving companies such as Agfa, Taiyo and Parachem.
In announcing this now we are mindful of the need to complete our registration by 6th January, as we are restricted to only 96 delegates for the visit to the Bugey Nuclear Power Plant. So please come and join us at what will be another memorable EIPC Conference, and Lyon in the winter is sublime. As for the gastronomy, we will find out!
- Deadline Registration Power Plant visit: January 6, 2023
- Max. number of visitors Power plant: 96
- Please be aware that Conference Day 2 including visit ends at 16.00 hrs on Feb 10.
- We need to receive a copy of the passport of all visitors to the Bugey Nuclear Power Plant before Jan 6, 2023
Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.