The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
EIPC Winter Conference Lyon, France 2023 Calls for Registration
December 9, 2022 | EIPCEstimated reading time: 1 minute
France is evocative of many things, amongst them some classics: their cuisine, their architecture, their music. In the latter category, who has not heard the timeless “Songs from the Auvergne” by Joseph Canteloube. Who has not been to Lyon, in the Auvergne Region?
If you wish to part of another classic event, then please consider joining the EIPC Winter Conference which is to be held over two days the first in the famous Grouparna Football Stadium in Lyon, wherein The Kopster Hotel will be our overnight stay venue; the second will be at the Bugey Nuclear Power Plant. In the evening of the first day we shall be dining, rather well, downtown Lyon centre.
The conference will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, ASS Luippold, Dyconex, Suss MicroTec, Showa Denko, NanYa and others. We will also be having a Round table for environmental matters e.g. REACH SVHC solder mask restrictions, involving companies such as Agfa, Taiyo and Parachem.
In announcing this now we are mindful of the need to complete our registration by 6th January, as we are restricted to only 96 delegates for the visit to the Bugey Nuclear Power Plant. So please come and join us at what will be another memorable EIPC Conference, and Lyon in the winter is sublime. As for the gastronomy, we will find out!
- Deadline Registration Power Plant visit: January 6, 2023
- Max. number of visitors Power plant: 96
- Please be aware that Conference Day 2 including visit ends at 16.00 hrs on Feb 10.
- We need to receive a copy of the passport of all visitors to the Bugey Nuclear Power Plant before Jan 6, 2023
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.