Powering the Future: When Material Choice Defines RF Performance
Learning with Leo: The Cost of Cleaning and Protecting the Ozone Layer
Nolan’s Notes: Cleaning With Smaller Geometries
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. The standard provides valuable and practical information to those who use or are considering using BGAs, descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrates printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart-molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
IPC-2294
Design Standard for Printed Electronics on Rigid Substrates
IPC-2294 establishes specific requirements for the design of printed electronics applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates, as applies to IPC-2294, are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive, or nonconductive.
Read about the rest of the standards being released in the Winter 2025 issue of IPC Community.
