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Ventec Expands Hydrocarbon PCB Laminate Range for High-end RF, Microwave Applications
December 13, 2022 | Ventec International Group Co., Ltd.Estimated reading time: 1 minute
Ventec International Group Co., Ltd., has expanded its tec?speed 20.0 range of hydrocarbon-based PCB materials with the new tec-speed 20.0 VTM1000i hydrocarbon laminate. Offering impressive thermal reliability and exceptionally high Dk (9.8) and low Df (0.0023) typically seen only in PTFE materials, this next generation hydrocarbon laminate presents the industry with a lower budget solution for high-end RF applications, including satellite communications and 5G RF use.
Designed for antenna and communication systems, radar, and aviation systems, tec-speed 20.0 VTM1000i is available in a range of dielectric thickness, with 0.38 mm through to 3.81 mm options and offers high decomposition temperature (Td) of 426°C.
Providing considerable power integrity benefits, the high Dk value (9.8 ± 0.0245 @ 10 Ghz) provides larger interplanar capacitance than other hydrocarbon laminates in this range, offering an alternative option for specific application in the microwave and RF industry previously available only through more costly PTFE laminates.
Manufactured at Ventec’s state-of-the-art facilities based in Taiwan and China, tec-speed 20.0 VTM1000i is available worldwide thanks to Ventec’s managed global supply chain, providing reliable disruption-free delivery in Asia, Europe, and the Americas.
“At Ventec we are constantly refining and improving our range to help our customers achieve their special and future performance goals. tec-speed 20.0 VTM1000i represents a top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry, and is an important addition to our tec-speed range,” commented Jason Chung, CEO of Ventec International Group. “We will be showcasing this new laminate worldwide at events throughout 2023.”
tec-speed 20.0 VTM1000i will debut at the IPC APEX Expo 2023 in San Diego on booth 419 from 24-26 January.
Additional content from Ventec International Group:
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
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