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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Take Your Rework to the Next Level with Auto Align from VJ Electronix at APEX
December 13, 2022 | VJ ElectronixEstimated reading time: 1 minute
VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, will exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will demonstrate the Summit 1800i rework system and the Summit 2200i rework with new Auto Align in Booth #1507.
The Summit 2200i is a high precision, fully automatic system for medium-sized SMD assemblies. The Summit 2200i is capable of handling boards up to 22"x30” and components as small as 01005, and requires minimal operator intervention. The new automatic alignment allows for alignment of components with no operator intervention required.
The latest in the Summit 1800 family, the most installed rework system in the world, the Summit 1800i is capable of handling boards up to 22"x30” and components as small as 01005. The high precision, semi-automatic system is ideal for everything from small to large-sized SMD assemblies.
Built with easy-to-use 1-2-3-GO software, operation of this rework system is simple and intuitive. Efficient convection heating provides high thermal throughput, uniformity and a repeatable rework process. Automatic non-contact site scavenging safely removes residual solder, eliminating potential for damage to pads and solder mask. Proprietary software provides product traceability, profile analysis and sharing of profiles between VJE systems.
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Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.