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Koh Young Highlighting Award-winning True3D Inspection Solutions at IPC APEX EXPO
December 15, 2022 | Koh Young TechnologyEstimated reading time: 4 minutes
Koh Young Technology, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, will deliver live demonstrations of its award-winning inspection and measurement solutions during the live tradeshow in the San Diego Convention Center on January 24-26, 2023, in San Diego, California. Koh Young will highlight several award-winning solutions at the Koh Young America booth (1116). The following is just a glimpse into what Koh Young will have in store for our visitors.
Solder Paste Inspection (SPI)
In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With a patented dual-projection technology, we deliver trustworthy and repeatable measurement data, which manufacturers can use to reliably optimize the print process.
- KY8030-3: Industry’s Fastest True3D SPI Solution with Integrated Auto-Repair Dispenser
- aSPIre3: Industry’s Highest Performing True3D SPI Solution
Automated Optical Inspection (AOI)
The Koh Young 3D AOI Zenith delivers perfect inspection performance with True3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board color variations. When our 3D measurement data meets artificial intelligence, we can deliver even more advantages to manufacturers.
- Zenith Alpha: Best Value True3D Automated Optical Inspection Solution
- Zenith UHS: Industry’s Fastest True3D AOI Solution
- Zenith 2: Revolutionary True3D AOI Delivering Incomparable Capabilities
- Meister D: Industry’s Leading Inspection Systems for Advanced Packaging & Semiconductors
Automated Pin Inspection (API)
Built on its world-class True3D™ AOI technology, new enhancements help it break through barriers associated with inspecting products with a mix of both Pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press-fit, and Final Optical Inspection, as well as for pins inside a connector shroud, while also inspecting traditional SMDs on the same product. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed.
KY-P3: Industry-awarded breakthrough in 3D Automated Pin Inspection
Dispense Process Inspection (DPI)
The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.
- Neptune T: Industry’s First 3D Optical Measurement Instrument for Transparent Materials
- Neptune C+: Award-winning True3D In-Line Dispensing Process Inspection (DPI) Solution
Process Control Software
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes. Koh Young can help manufacturers solve significant business challenges by applying connectivity to modernize industry processes. By leveraging IPC-CFX with its AI-powered technologies, Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge. Combined with IPC communication standards, Koh Young can open the gates to a smart factory for anyone.
- KSMART: Seamless Smart Factory Software Suite Turning Data into Insights
Process Optimization Software
The award-winning Koh Young Process Optimizer (KPO Printer) solution is an AI-based automatic print process optimizer. This system improves the printer offset, as well as critical printer parameters like squeegee speed, print pressure, and separation speed. KPO performs an automated DOE to determine the optimum printing parameters for the best print quality. As a result, manufacturers can optimize the print process, without the need for a dedicated print process expert. Furthermore, KPO monitors and perfects parameters in real-time to guarantee quality despite environmental changes.
- KPO Printer: Award-winning AI-powered print process control software
Art of the Possible Podcast
IPC APEX EXPO 2023 Edition with John W. Mitchell, IPC president and CEO gives you a sneak peek into what you can expect at the premier event for the electronics manufacturing industry. This year marks the 20th time Koh Young has exhibited at IPC APEX EXPO. “APEX is a lynchpin for our business success in the coming year. It is important to our growth potential, so we plan every aspect very carefully. It’s our Superbowl, so we make sure to prepare for it accordingly. The results can mean the difference between a good year and a great year!” explained Joel Scutchfield, General Manager of SMT Business Operations and Director of Sales at Koh Young America.
To learn more about how our solutions boost your quality, visit us at the IPC APEX EXPO in Booth 1116 at the San Diego Convention Center in California.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.