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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 16, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

The holiday season is in full swing for most of us; no matter which holiday you choose to recognize here in the second half of December, it’s almost certain that your routine has some level of interruption to it right now. Chances are, you might not be consuming as much of your usual diet of industry news and information, what with all the holiday treats and traditional meals to be consumed instead. That, gentle reader, is why we bring you this week’s Top 5 editor’s picks–your slimmed down version of the news, leaving you more time for the other delights of the season. So without further ado, we bring you the five news items you really should make room for this week.
And, as ever, the staff at I-Connect007 wish you a healthy, happy, joyous holiday season.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Published December 13
The best way to introduce this dispatch from the Institute of Circuit Technology’s Christmas Seminar, is to quote Pete Starkey’s opening paragraph:
“Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme.”
Starkey’s reporting from the technical conference field is highly sought after reading for so many of us, and this report does not disappoint. Definitely recommended reading.
Pan Pacific Microelectronics Symposium 2023 Program Finalized
Published December 14
The program for the 27th Annual Pan Pacific Microelectronics Symposium has been finalized. The event, which will take place from Jan. 30 to Feb. 1, 2023, at the Sheraton Kauai Resort on Kauai, Hawaii, promotes international technical interchange and provides a premier forum for global networking among microelectronics professionals and business. Read more here for details.
Physics, Electrical Engineering, and PCB Design
Published December 9
Tamara Jovanovic is a periodic contributor to Design007 magazine, and an insightful voice of the young PCB design professional. In this article, published in the November 2022 issue, which we themed “Maxwell vs. Moore: A Fight to the Physics,” Jovanovic delves into how her classroom education and her daily professional life intersect in useful and interesting ways. Readers definitely responded to her writing.
Industry Innovation Starts Here
Published December 9
If you haven’t already started planning your trip to IPC APEX EXPO in San Diego, then it’s definitely time to start. This news piece, courtesy the IPC conference staff, calls out six key reasons that you—or someone from your team—should be at the conference. Helpful tips for getting the greatest value for your registration dollar are included. Give it a read, then book your plane tickets.
EIPC: Europe’s Energy Disadvantage
Published December 15
In this interview, EIPC’s Alun Morgan details the unsettling realities facing the European PCB industry due to the current war in Ukraine, and outlines steps that the EIPC plans to take to help raise awareness of the possible perils the industry might face as a result.
Suggested Items
GTSMT SMT Production Lines are Transforming Modern Electronics Manufacturing
05/29/2025 | EINPresswire.comGTSMT, a prominent leader in the Surface-Mount Technology (SMT) sector, announced the introduction of cutting-edge innovations designed to tackle the evolving challenges facing the global electronics manufacturing industry.
Amtech Electrocircuits’ CEO Jay Patel Launches Petition Advocating for 10% Tax Credit to Support U.S. Electronics Manufacturers
05/28/2025 | Amtech ElectrocircuitsAmtech Electrocircuits, a leading provider of manufacturing solutions, announces that CEO Jay Patel has initiated a petition urging policymakers to implement a 10% tax credit for Original Equipment Manufacturers (OEMs) sourcing from U.S. electronics manufacturers.
UNIST, SK On Strengthen Collaboration to Cultivate Battery Talent and Enhance R&D Capabilities
05/28/2025 | UNISTUNIST announced its plans to deepen collaboration with SK On to foster talent in the battery industry. This strategic partnership aims to attract outstanding researchers, broaden the foundation of research and development, and secure future competitive advantages.
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
05/28/2025 | Mike Konrad -- Column: The Knowledge BaseMembership in trade associations like the Surface Mount Technology Association (SMTA) offers substantial benefits that can significantly enhance a professional's career in the electronics manufacturing industry. These advantages encompass extensive networking opportunities, access to specialized technical conferences, and complimentary training programs, all contributing to professional growth and industry recognition.
Huawei Single SitePower Solution Creates Four Synergies to Accelerate Site Intelligence
05/27/2025 | PRNewswireDuring the 9th Global ICT Energy Efficiency Summit in Dubai, Huawei showcased its next-generation digital and intelligent site power facility solution Single SitePower, which is set to drive the intelligent transformation of ICT energy infrastructure.