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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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The Most-read I-Connect007 Articles of 2022
December 26, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like an Avril Lavigne album
So, grab a cup of eggnog and curl up by the fire! For your holiday enjoyment, here’s a blast from the past: the top five most-read I-Connect007 articles of 2022.
Review: Institute of Circuit Technology 2022 Annual Symposium
Once again, European Technical Editor Pete Starkey holds onto the top spot. Pete covers conferences and trade shows around Europe. Everything Pete writes is golden, and he has fans across Europe and around the world. Stop by our booth at IPC APEX EXPO and say hi to Pete.
Jahr Turchan Discusses Blackfox's Training Scholarships for Veterans
Nolan Johnson’s interview with Jahr Turchan of Blackfox Training Institute drew a lot of eyes to the page. There’s a shortage of subject matter experts in the industry, and Blackfox’s Veteran Advanced Manufacturing Certification program is helping bring transitioning veterans into the workplace. We need more ideas like this.
Finally! A Book About PCB Stackups
The PCB design industry is hungry for information about stackup design, and Bill Hargin of Z-zero seems to have written the right book at the right time. This I-Connect007 eBook has been flying off the virtual bookshelves all year. It would make a perfect late Christmas present.
PCB Plating Still Comes Down to Physics
As I said, we never know what articles are going to hit it big each year. This interview with columnist Michael Carano covered the ins and outs of plating technologies and processes, which might seem like a fairly “mature” topic. But this interview drew big numbers. Readers are looking for information, and we seem to have what they’re looking for.
A Definitive Review of New Expert Guide to High-Performance Materials
This year, we published a variety of eBooks on topic from across the spectrum. Happy Holden’s review of the I-Connect007 eBook The Printed Circuit Designer’s Guide to… High Performance Materials really took off. As Happy explains, this book, written by Michael Gay of Isola, lays out everything you need to know about high performance PCB materials.
Suggested Items
Seeing a Future in Mexico
07/09/2025 | Michelle Te, I-Connect007The Global Electronics Association (formerly known as IPC) has been instrumental in fostering a partnership with Guanajuato, a state north of Mexico City with 12 industrial clusters and close to 150 companies involved in electronics. This past spring, Alejandro Hernández, the undersecretary for investment promotion in Guanajuato, attended IPC APEX EXPO 2025 at the invitation of IPC Mexico Director Lorena Villanueva, where he met with several companies to discuss the opportunities available in Mexico. He is inviting electronics-related companies seeking long-term investment in a centrally located area with access to highways, railways, and ports.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
IPC-CFX, 2.0: How to Use the QPL Effectively
07/02/2025 | Chris Jorgensen, Global Electronics AssociationIn part one of this series, we discussed the new features in CFX Version 2.0 and their implications for improved inter-machine communication. But what about bringing this new functionality to the shop floor? The IPC-CFX-2591 QPL is a powerful technical resource for manufacturers seeking CFX-enabled equipment. The Qualified Product List (QPL) helps streamline equipment selection by listing models verified for CFX compliance through a robust third-party virtual qualification process.
The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
07/08/2025 | Mike Konrad -- Column: The Knowledge BaseIn electronics manufacturing, there’s a dangerous misconception that cleaning and coating are standalone options, that they operate in different lanes, and that one can compensate for the other. Let’s clear that up now. Cleaning and conformal coating are not separate decisions. They are two chapters in the same story—the story of reliability.
Advancing Aerospace Excellence: Emerald’s Medford Team Earns Space Addendum Certification
06/30/2025 | Emerald TechnologiesWe’re thrilled to announce a major achievement from our Medford, Oregon facility. Andy Abrigo has officially earned her credentials as a Certified IPC Trainer (CIT) under the IPC J-STD-001 Space Addendum, the leading industry standard for space and military-grade electronics manufacturing.