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Bloom Energy Expands its Energy Platform Customer Base to Taiwan
December 30, 2022 | Business WireEstimated reading time: 1 minute
Bloom Energy has entered into an agreement with Unimicron, a chip substrate and printed circuit board maker (PCB), to deploy up to 10MW of fuel cells at Unimicron plants in Taiwan. The installations will begin in 2023 and be completed by 2026. With this, Bloom Energy will have deployed its solid oxide fuel-cell based Energy Server™ in four Asian countries.
“Bloom’s superior energy technology capabilities are attractive to companies that need reliable power,” said Tim Schweickert, Senior Managing Director, International Business Development, Bloom Energy. “That is particularly true of semiconductor fabs, which must meet a global demand for their products that shows no signs of abating. Bloom’s fuel-flexible platform can fill Unimicron’s needs today, with fuels that are available now, and they can transition to renewable fuels and hydrogen as those sources become more widely available.”
Reliable, high-quality power is critical to manufacturing operations particularly in the semiconductor and PCB operations because of the global demand for their products and the cost of electric power relative to their bottom line. Manufacturing facilities are also carbon intensive. Taiwan has set ambitious decarbonization goals for its industries. Bloom’s Energy Server, which can produce electricity from a variety of fuels without combustion, can play an important role in Taiwan’s decarbonization.
Bloom’s energy platform can be configured to create a microgrid that can operate alongside an electricity grid, or independently of it. When powered by a fuel source with an underground pipeline system, such as natural gas, they are less susceptible to the impacts of extreme weather, enabling safe, continuous operation and avoiding the costly consequences of unplanned downtime. Bloom’s technology also enables customers to plan against price volatility by locking in a large portion of their electricity cost, with multiple financing options and flexible term lengths.
Bloom unveiled a multi-gigawatt manufacturing plant in Fremont, California in July 2022 to meet growing demand for its technology. The $200 million investment created a state-of-the-art, 164,000 square foot facility followed the opening of a new research center and a global hydrogen development facility in Fremont, bringing Bloom’s footprint there to more than 524,000 square feet. In addition, Bloom added a high-volume commercial line for electrolyzers at its Newark, Delaware facility, increasing the company’s electrolyzers generating capacity to two gigawatts. The award-winning technology is the most energy-efficient design to produce clean hydrogen to date.
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Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.