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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
May 29, 2025 | Amphenol Printed CircuitsEstimated reading time: Less than a minute
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.
Visitors to booth #1126 in the Moscone Center can see examples of PCBs for commercial and military applications, including high-speed-digital (HSD) circuits to 25 Gb/s, RF/microwave planar antenna arrays and beamforming networks to 40 GHz and beyond, and hybrid combinations of analog, digital, and RF/microwave assemblies precision designed, assembled, and tested in APC’s world-class facilities in Nashua, NH, Mesa AZ, and Nogales Mexico, delivering full turnkey assembles.
Maintaining strong relationships with leading circuit material suppliers and leveraging Amphenol’s vast portfolio of RF connectors and components, Amphenol Printed Circuits has designed and manufactured PCBs and backplanes for commercial and mission-critical Military applications for more than 30 years. Based on the latest low-loss rigid, flex, and rigid-flex circuit materials, and with low-profile copper, these cost-effective circuit solutions serve the most challenging requirements in aerospace/defense, industrial, space, and telecommunications applications.
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Rachael Temple - AlltematedSuggested Items
MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout
08/22/2025 | Cadence Design SystemsMorgan State University (MSU) recently received an Apple Innovation Grant, designed to support engineering schools as they develop their silicon and hardware technologies. The New Silicon Initiative (NSI) is designed to inspire and prepare students for careers in hardware engineering, computer architecture, and silicon chip design.
Avary Holding, a Subsidiary of Zhen Ding, Board Approves Huai’an Park Investment
08/22/2025 | Zhen DingZhen Ding Technology Holding Limited, a global leading PCB manufacturer, announced on behalf of its subsidiary, Avary Holding (Shenzhen) Co., Ltd., that the Board of Directors has approved the Huai’an Park investment plan.
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/21/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
SEL: Revolutionizing PCB Production Through MES, Partnerships, and Vision
08/21/2025 | Barry Matties, I-Connect007Two years ago, we visited Schweitzer Engineering Laboratories (SEL) to better understand its new captive greenfield PCB facility. We recently returned, this time to discuss how this bold vision has transformed the industry. Barry Matties met with John Hendrickson, engineering director, and Jessi Hall, vice president of vertical integration, to discuss the transformative capabilities of Factory Core, SEL’s custom manufacturing execution system (MES), which allows for real-time monitoring of workflow and machine performance, and has led to impressive improvements in quality and cost efficiency.
Inventing the Future: An Interview with Dr. Ed Schweitzer
08/20/2025 | Barry Matties, I-Connect007Dr. Edmund O. Schweitzer III, founder of Schweitzer Engineering Laboratories (SEL), has a corner office in the company’s world headquarters in Pullman, Washington. Forty-two years after his SEL-21—the first microprocessor-based digital protective relay—ushered in a new era of power-system protection, he has forever changed the way the world safeguards its electric grids. In this three-hour conversation, Dr. Schweitzer reveals that he remains excited to get to work each day, unpacking the “better, cheaper, faster, simpler” mantra that’s still driving SEL’s innovation, and the culture glue that keeps more than 7,000 employee-owners rowing in unison.