It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
atg-Luther Maelzer to Exhibit at IPC APEX 2023
January 16, 2023 | atg Luther & Maelzer GmbHEstimated reading time: 1 minute
atg Luther & Maelzer GmbH is looking forward to meeting with attendees at the upcoming IPC APEX EXPO 2023 in booth 141 on January 24 through the 26 at the San Diego Convention Center in San Diego, CA. The company will be showcasing their latest automatic flying probe test system the atg A9a.
atg’s A9a can test pad sizes down to 35 micron and is capable of testing products up to a size of 21” x 24”. The A9a features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 m?, HIPOT and latent testing. In combination with a test speed of up to 230 measurements/second, the A9a provides a “lights-out” automated handling solution for larger production runs. To achieve high throughput the key feature of the A9a is a dual shuttle system, which reduces the product exchange time to zero seconds in automation mode.
With more than 180 employees worldwide, atg Luther & Maelzer is the leading supplier of electrical testing solutions for the printed circuit board industry. They have solutions for every application regardless of product type, batch size or technology deployed. Atg’s flying probe tester products are renowned for automation, speed, accuracy, versatility, and ease of use.
atg Luther & Maelzer’s parent company is Mycronic, which offers a comprehensive portfolio of solutions and technologies and a global network of strategically deployed applications and support resources. Additional information can be found at www.atg-LM.com or www.Mycronic.com.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.