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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 6, 2023 | Andy Shaughnessy, Design007Estimated reading time: 2 minutes
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O
It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
Southeast Asia PCB Industry Report 2023-2032: Sector Set to Grow as Living Standards Increase
Published January 5
Interesting news from Southeast Asia: The standard of living is rising there, and PCB sales are expected to continue to grow. But it’s a mixed bag. Check out the different per capita GDP for Singapore vs. Cambodia. We can expect the PCB industry to keep expanding in Southeast Asia, because these countries have vast labor resources and fairly friendly business environments.
Ventec: Contextualizing the CHIPS Act
Published January 5
There’s been a lot of talk about the CHIPS Act, which Washington hopes will attract investment in semiconductor development and manufacturing to the U.S. But what does this legislation actually mean for the electronics industry? Ventec’s Alun Morgan and Mark Goodwin share their thoughts on the nuts and bolts of this act, and its potential effect on our industry.
PCB Designer Dave Graves Has Passed Away
Published January 3
Sorry to hear about Dave Graves, who passed away just before Christmas as 65. I first met Dave when he won the Top Gun design competition at PCB West 20 years ago. He co-founded UltraCAD and spent years working at Monsoon Solutions. He was a great guy; the industry will miss him.
A CMMC ‘Plan B’
Published January 5
If you’re like me (and who isn’t?), you’ve been wondering about all the hullabaloo regarding CMMC. Well, you’re in luck. Divyash Patel of MX2 Technology has a great article in the newest issue of SMT007 Magazine that explains everything you need to know about the latest developments in Cybersecurity Maturity Model Certification.
Happy’s Tech Talk #15: Printed Electronics Using Flex
Published January 5
I’ve always seen printed electronics and flexible circuits as similar technologies; now it looks like these two love birds may be headed to the altar. In his column, Happy Holden explains how PEC technologists are using flex technology concepts to facilitate new applications. No one doubts PEC’s usefulness, but it seems to have plateaued over time. Will this arranged marriage with flex enable PEC to finally become the disruptive technology that many analysts predicted a decade ago?
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Brent Fischthal - Koh YoungSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.