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Digital Twin Concept in Copper Electroplating Process Performance

07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.
PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.

Kitron Reports Strengthening Momentum in Q2 2025

07/10/2025 | Kitron
Kitron reported solid quarterly sales and profits, particularly driven by the Defence & Aerospace market sector.

Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)

07/10/2025 | Infineon
As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.

TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development

07/09/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.

GlobalFoundries to Acquire MIPS to Accelerate AI and Compute Capabilities

07/09/2025 | GlobalFoundries
GlobalFoundries announced a definitive agreement to acquire MIPS, a leading supplier of AI and processor IP. This strategic acquisition will expand GF’s portfolio of customizable IP offerings, allowing it to further differentiate its process technologies with IP and software capabilities.
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