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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Arlon Appoints Jason Maupin as COO
January 18, 2023 | Arlon EMDEstimated reading time: 1 minute
Arlon announced the addition of Jason Maupin as Chief Operating Officer. In this role Mr. Maupin will oversee Arlon’s specialty materials business as well as EMC’s laminate distribution business in N. America. This hiring move is the result of Arlon’s current President, Brad Foster announcing his intent to retire in early 2023, after 21 years with Arlon.
“Hiring Jason is a very good move for the organization. He brings sound business practices, industry knowledge, and strong leadership skills to Arlon. These will be needed as Arlon and EMC look to grow business in N. America.”, commented Mr. Foster.
Mr. Maupin brings to Arlon over 25 years of electronics industry experience. He comes to Arlon from Dymax Corporation, where he was the Chief Commercial Officer. Before that, Mr. Maupin was Regional President of Enthone, a specialty chemical provider to the printed circuit, semi-conductor and general metal finishing industries. Prior to entering the commercial sector, Mr. Maupin was in the US Navy from 1991-1996, where he served on the Fast Attack submarine USS Jefferson City.
“As a result of EMC’s acquisition, Arlon is now uniquely positioned in N. America to leverage product portfolios, R&D capabilities, and the financial strength of EMC to rapidly introduce new products, expand Arlon’s capacity, and upgrade manufacturing. These advancements will enable Arlon to increase product offerings into core customers as well as expand globally into other markets. This is an exciting opportunity to combine two truly unique organizations and offer the best of both to OEM and fabricator customers”, stated Mr. Maupin.
About Arlon: Arlon EMD is a US manufacturer of specialty materials. Arlon has supplied materials for the North American, UK, European, Israeli and Asian markets for more than 35 years from their manufacturing location in Rancho Cucamonga, California.
About EMC: Elite Material Co. Ltd. (EMC), established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
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Simon Khesin - Schmoll MaschinenSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
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Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.