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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Arlon Appoints Jason Maupin as COO
January 18, 2023 | Arlon EMDEstimated reading time: 1 minute

Arlon announced the addition of Jason Maupin as Chief Operating Officer. In this role Mr. Maupin will oversee Arlon’s specialty materials business as well as EMC’s laminate distribution business in N. America. This hiring move is the result of Arlon’s current President, Brad Foster announcing his intent to retire in early 2023, after 21 years with Arlon.
“Hiring Jason is a very good move for the organization. He brings sound business practices, industry knowledge, and strong leadership skills to Arlon. These will be needed as Arlon and EMC look to grow business in N. America.”, commented Mr. Foster.
Mr. Maupin brings to Arlon over 25 years of electronics industry experience. He comes to Arlon from Dymax Corporation, where he was the Chief Commercial Officer. Before that, Mr. Maupin was Regional President of Enthone, a specialty chemical provider to the printed circuit, semi-conductor and general metal finishing industries. Prior to entering the commercial sector, Mr. Maupin was in the US Navy from 1991-1996, where he served on the Fast Attack submarine USS Jefferson City.
“As a result of EMC’s acquisition, Arlon is now uniquely positioned in N. America to leverage product portfolios, R&D capabilities, and the financial strength of EMC to rapidly introduce new products, expand Arlon’s capacity, and upgrade manufacturing. These advancements will enable Arlon to increase product offerings into core customers as well as expand globally into other markets. This is an exciting opportunity to combine two truly unique organizations and offer the best of both to OEM and fabricator customers”, stated Mr. Maupin.
About Arlon: Arlon EMD is a US manufacturer of specialty materials. Arlon has supplied materials for the North American, UK, European, Israeli and Asian markets for more than 35 years from their manufacturing location in Rancho Cucamonga, California.
About EMC: Elite Material Co. Ltd. (EMC), established in 1992 as a copper clad (CCL) and prepreg manufacturer, has become the global leader in the manufacture and supply of Halogen free CCL materials. Elite’s highly skilled Research & Development team has developed a family of materials from mid-loss to extreme low loss products. These materials are designed in complex PCB’s; mSAP, IC substrate, high layer count (HLC)/ high speed digital (HSD) and radio frequency (RF) products.
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Julia McCaffrey - NCAB GroupSuggested Items
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
Designers Notebook: Basic PCB Planning Criteria—Establishing Design Constraints
07/22/2025 | Vern Solberg -- Column: Designer's NotebookPrinted circuit board development flows more smoothly when all critical issues are predefined and understood from the start. As a basic planning strategy, the designer must first consider the product performance criteria, then determine the specific industry standards or specifications that the product must meet. Planning also includes a review of all significant issues that may affect the product’s manufacture, performance, reliability, overall quality, and safety.