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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 20, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

We’re in the middle of show season, and it certainly “shows.” Thank you very much. I’m here all week. Don’t forget to tip your wait staff.
This week, we published a variety of articles, columns, and news items, and much of it centered on trade shows. Technical Editor Dan Feinberg brings us a report from CES 2023. IPC announced the winners of the Best Technical Paper awards for IPC APEX EXPO 2023. And we have an interview with Altium’s Rea Callender about the company’s educational efforts at APEX and around the globe.
We saw some big M&A news this week as APCT acquired Advanced Circuits, continuing APCT’s years-long growth streak. And Sam Sadri of QP Technologies discusses an alternative to ceramic packaging—open-cavity plastic packaging—that might be a great solution to the DoD’s packaging material supply chain issues.
It’s been a busy week, and it’s about to get much busier. If you’re at APEX next week, stop by and say hi. Then I’m off to DesignCon a few days later. I’ll be home eventually. I hope to see you on the road!
Fein-Lines: An Eye-Popping Eureka Park and ShowStoppers at CES 2023
Published January 16
Technical Editor Dan Feinberg has been at every CES show for over a decade, and he’s become our go-to guy for coverage of the consumer electronics market. In this review, Dan discusses all kinds of cool gadgets that he checked out at the show. I never knew I needed an air-to-water dispenser that transforms moisture in the air into alkaline water.
Altium Focuses on Design Education
Published January 16
In this interview, Rea Callender, Altium’s VP of education, explains the firm’s partnerships with colleges that provides EDA software for students. Rea also discusses their special focus on outreach to women in electronics design. Altium is supplying the software for this year’s Design Competition at APEX as well.
Compass Diversified Announces Sale of Advanced Circuits to APCT
Published January 17
Mergers and acquisitions continue in this industry, with APCT entering an agreement to buy Colorado-based Advanced Circuits. If approved, this deal would be worth $220 million and add a variety of technologies to APCT’s offerings. APCT has been acquiring board shops for the past few years.
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
Published January 17
OCPP? Well, you know me. Military and aerospace contractors are having a rough time securing a solid supply chain for next-gen packaging materials. But as Sam Sadri explains, open-cavity plastic packaging (OCPP) is a lower-cost, reliable option that may be the answer to your mil-aero packaging needs.
Best Technical Papers at IPC APEX EXPO 2023 Selected
Published January 16
The best technical papers from this year’s APEX have been named, and they run the entire gamut. The authors represent 18 countries and 15 are in the “next generation” category—five years or less in the industry. It’s good to see new, young people taking an interest in the industry; they will be running things in 20 years, and we’re feeling pretty good about that.
Suggested Items
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.