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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Victory for AT&S at 'Austria’s Leading Companies'
January 25, 2023 | AT&SEstimated reading time: Less than a minute
As a reward for a remarkable business performance in turbulent times, AT&S has received the ALC Award in the “Value Increase” category. AT&S CEO Andreas Gerstenmayer and VP Corporate Communications Gerald Reischl were live on stage at the event in Vienna’s Marx Halle on behalf of all employees to collect the award, which is presented for excellent work and the resulting economic performance over several years.
“We are particularly pleased to be the listed company whose value has developed the best in recent years. It is also a confirmation of the continuously excellent work of the entire AT&S team. Our shareholders know that they are investing in a company whose technology, which is essential for digitization, is steadily gaining in importance on the global market,” says CEO Andreas Gerstenmayer.
The ALC winners are not chosen by a jury, but judged on their performance. The most recent three annual financial statements are used for analysis and assessment. AT&S was able to convince with excellent value growth during the pandemic years, and can now count itself among the select circle of Austria’s Leading Companies for at least one year.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MacDermid Alpha to Debut Zero-PFAS Die Attach Paste ATROX CD 560-1 at SEMICON Southeast Asia 2026
04/27/2026 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions will debut ATROX® CD 560-1, a zero-PFAS conductive die attach paste, at SEMICON Southeast Asia 2026, May 5–7, in Kuala Lumpur, Booth 2423.
Fineline Global to Exhibit at PCB East 2026, Showcasing Global PCB Solutions for North American Market
04/23/2026 | Fineline GlobalFineline Global, a leading global provider of advanced printed circuit board (PCB) solutions, today announced that it will be exhibiting at PCB East 2026 on Wednesday, April 29 at the DCU Convention Center in Worcester, Massachusetts.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.