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Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

AS9100D and PCB Fabrication: What Supplier Quality Should Evaluate

07/28/2026 | Ryan O’Connor, SOMACIS
When a supplier quality engineer supporting aviation, space, or defense programs reviews a new PCB fabricator, one of the first checkpoints is simple: Is the AS9100D certificate current? That is an appropriate starting point. In regulated aerospace environments, configuration control, traceability, corrective action, and internal audit discipline are not optional. The standard establishes the quality management structure that those programs depend on. The more consequential evaluation begins after certification is confirmed. In multilayer and rigid-flex fabrication, performance reliability is shaped by how engineering review and process controls are executed day to day.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.

Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing

07/23/2026 | Team NCAB -- Column: Fresh PCB Concepts
IPC-6012 Class 3 is widely recognized as the benchmark for high-reliability manufacturing. Compared to Class 2, it establishes tighter requirements for plated holes, annular rings, copper wrap, conductor integrity, and inspection criteria. Those requirements reduce manufacturing defects and improve overall product quality. A common misconception is that a Class 3 PCB is inherently reliable. It isn't. IPC-6012 is fundamentally a workmanship and performance specification that defines manufacturing acceptability after the design is complete.

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.
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