Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Dan’s Biz Bookshelf: ‘Growth Hacker Marketing’
Happy’s Tech Talk #38: Novel Metallization for UHDI
MKS’ Atotech to Participate at Semicon Korea 2023
January 25, 2023 | MKS’ AtotechEstimated reading time: 1 minute
MKS’ Atotech will be exhibiting at Semicon Korea 2023. The show will be held at COEX, Seoul from February 1-3 and our team will be at booth C844 in hall C to inform about our ECD processes for advanced packaging and electroless processes for power semiconductors.
The fabrication of modern semiconductor devices requires different plating solutions for the different applications and structures. Atotech provides the complete plating offering for pillars, micro vias, fine line RDL (redistribution layer) and solder application which are required in advanced packaging. Additionally, we offer leading ENEPIG plating solutions for pad metallization for power applications.
Our show highlights include: Spherolyte® Cu UF 3 and Spherolyte® Cu DB / NT Cu.
Spherolyte® Cu UF 3 serves to deposit pure Cu for RDL and via filling in advanced packaging applications such as in fan-out wafer level packaging (FOWLP). Spherolyte® UF 3 enables high reliability with higher via filling performance, stable plating uniformity and higher copper purity compared to conventional Cu processes.
In addition, our R&D processes Spherolyte® Cu DB and Spherolyte® NT Cu are targeted towards next generation Cu-to-Cu hybrid bonding applications with low annealing temperatures. Spherolyte® Cu DB is one of our processes, allowing the deposition of metastable copper, while Spherolyte® NT Cu allows the deposition of copper nanotwins.
Event: Semicon Korea 2023
Date: February 1-3, 2023
Venue: COEX, Seoul
Booth: C844
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.