Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
SEHO: New Functions Increase Cost-Efficiency and Energy-Efficiency in Wave Soldering Processes
January 27, 2023 | SEHOEstimated reading time: 1 minute
SEHO North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, is one of the most innovative companies in the industry. Some of these innovations are aimed at taking cost-efficiency and energy-efficiency in the wave soldering process to a new level.
New pulsar emitters allow remarkably higher flexibility in the preheat area. Configuring emitters individually instead of using entire segments helps to realize the shortest distances between assemblies. Thus, there is virtually no wait time required between assemblies with different heat energy demands, ensuring highest energy-efficiency. This preheating concept allows for the cost-efficient and sustainable manufacture of large series as well as a batch size of one.
SEHO’s new automatic nozzle height adjustment provides higher flexibility in the soldering area of wave solder systems, particularly if a large number of different variants are to be manufactured. The height of each solder nozzle can be adjusted via the software, which allows creating the optimal product-specific distance between the circuit board and solder nozzle. This innovative function provides independence from the workpiece carrier or assembly design, a remarkably larger process window, maximum flexibility and process reliability.
Consistent height of the solder wave is crucial for wave soldering processes. SEHO provides the first automatic wave height measurement, built into the soldering section of the MWS 2300. This feature is based on a contact measurement that produces reliable results and processes for laminar as well as turbulent solder waves. Based on the measuring results, the wave height is automatically regulated within adjustable tolerances. The system thereby ensures the same height across the entire wave width at any time. The complete logging of all measured values and parameters also provides a proof of quality of the manufactured products.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.