The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
NIST Resources for CHIPS Act Participants
January 27, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
At the recent IPC Advanced Packaging Symposium, Dr. Frank W. Gayle, deputy director of the Advanced Manufacturing National Program Office, an interagency team with core staff hosted at the U.S. National Institute of Standards and Technology (NIST), gave a presentation on the work NIST has recently undertaken in support of both the semiconductor and R&D sectors, and the CHIPS and Science Act.
In Gayle’s presentation, he said the vision for the CHIPS and Science Act (also known as the CHIPS Act) is to develop and preserve three key areas: economic security, national security, and future innovation.
He emphasized that the CHIPS Act is about more than just the semiconductor chips, reserving an entire slide for that point alone. While NIST acknowledges that the U.S. holds an impressive 85% stake in the semiconductor design market, only 3% of the global packaging industry resides within the U.S.
In support of this mission, Gayle drew attention to a series of resources that are now available on NIST.gov:
- Metrology and Standards
“Strategic Opportunities for U.S. Semiconductor Manufacturing: Facilitating U.S. Leadership and Competitiveness through Advancements in Measurements and Standards,” August 2022.
- Stakeholder Input on CHIPS Act
“Incentives, Infrastructure, and Research and Development Needs to Support a Strong Domestic Semiconductor Industry: Summary of Responses to Request for Information,” August 2022. - Commerce Strategy for Implementation
“A Strategy for the CHIPS for America Fund,” September 2022.
- Semiconductor Supply Chain RFI Findings
“Results from Semiconductor Supply Chain Request for Information,” January 2022.
Gayle concluded that the Incentives Program application process will be announced in February 2023 with funding proposals considered on a rolling basis. Learn more about the CHIPS Act at nist.gov.
References
- Data courtesy of the U.S. Department of Defense and IPC.
This article originally appeared in the January 2023 issue of SMT007 Magazine.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.