-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Full Turnkey Solutions Included in New Altus Brochure
January 30, 2023 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading distributor of capital equipment for electronics assembly in the UK and Ireland has announced the release of its new 2023 product brochure which includes full turnkey solutions for SMT, THT and component management.
The 32-page, full-colour document highlights Altus’ products and services including the industry’s most highly-advanced technology. With a mix of tier-one suppliers and equipment, the selection of systems and solutions will help to optimise processes, improve production through turnkey solutions, increase the level of quality and cut down overall costs for electronic manufacturers.
Joe Booth, Altus CEO said: “We are really proud of the range of equipment and class-leading suppliers we can utilise to support our customers. What’s more is that we can comfortably support individual system improvements and be a trusted partner to implement full turnkey lines. This includes solutions across SMT, conventional production, post production processes, and full component management.
“Our customers want a partner that understands production from end to end, offers solutions, and highlights the considerations to reduce their risk. That is the value we aim to bring to our discussions with them and in our support for their pre-sales and post sales lifecycle with Altus.”
As well as highlighting the most innovative equipment available to the electronics sector, the brochure underlines Altus’ unrivalled customer support. Joe said: “We appreciate that the selection of a provider is not just about buying the best technology available. What is just as important is working with a partner you can trust and this is why we focus on our support offering. With a team of experts in each area of electronic production, we also have the knowledge to offer sound advice which is important for manufacturers looking for the right solutions.”
New for the 2023 brochure are automatic optical inspection products from Magic Ray Technology. Featured in the brochure is the highly capable 2D THT AOI utilises 2D technology for post wave and post selective soldering applications.
Also featured for the first time is Lazipur high-speed pin insertion machines, including the all new INSERT H2 and INSERT H1 which have been developed with several benefits including being faster, more compact, modular in designed, adaptable, intuitive and user-friendly.
The new brochure also includes our long-standing pre-eminent suppliers including Koh Young, YJ Link, Heller Industries, and Cencorp Automation to name but a few.
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).