Full Turnkey Solutions Included in New Altus Brochure
January 30, 2023 | Altus GroupEstimated reading time: 1 minute

Altus Group, a leading distributor of capital equipment for electronics assembly in the UK and Ireland has announced the release of its new 2023 product brochure which includes full turnkey solutions for SMT, THT and component management.
The 32-page, full-colour document highlights Altus’ products and services including the industry’s most highly-advanced technology. With a mix of tier-one suppliers and equipment, the selection of systems and solutions will help to optimise processes, improve production through turnkey solutions, increase the level of quality and cut down overall costs for electronic manufacturers.
Joe Booth, Altus CEO said: “We are really proud of the range of equipment and class-leading suppliers we can utilise to support our customers. What’s more is that we can comfortably support individual system improvements and be a trusted partner to implement full turnkey lines. This includes solutions across SMT, conventional production, post production processes, and full component management.
“Our customers want a partner that understands production from end to end, offers solutions, and highlights the considerations to reduce their risk. That is the value we aim to bring to our discussions with them and in our support for their pre-sales and post sales lifecycle with Altus.”
As well as highlighting the most innovative equipment available to the electronics sector, the brochure underlines Altus’ unrivalled customer support. Joe said: “We appreciate that the selection of a provider is not just about buying the best technology available. What is just as important is working with a partner you can trust and this is why we focus on our support offering. With a team of experts in each area of electronic production, we also have the knowledge to offer sound advice which is important for manufacturers looking for the right solutions.”
New for the 2023 brochure are automatic optical inspection products from Magic Ray Technology. Featured in the brochure is the highly capable 2D THT AOI utilises 2D technology for post wave and post selective soldering applications.
Also featured for the first time is Lazipur high-speed pin insertion machines, including the all new INSERT H2 and INSERT H1 which have been developed with several benefits including being faster, more compact, modular in designed, adaptable, intuitive and user-friendly.
The new brochure also includes our long-standing pre-eminent suppliers including Koh Young, YJ Link, Heller Industries, and Cencorp Automation to name but a few.
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.