Three Industry Rising Stars Recognized at IPC APEX EXPO 2023
January 31, 2023 | IPCEstimated reading time: 1 minute

In recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges, three of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2023. Award recipients were Sarah Czaplewski-Campbell, Paige Fiet, and Christina Trussell.
Sarah Czaplewski-Campbell is a senior PCB reliability engineer and master inventor at IBM. An active participant in IPC standards committees, she received a Distinguished Committee Service Award for her contributions to the development of IPC-9121-A, Troubleshooting for Printed Board Fabrication Processes. Czaplewski-Campbell completed the IPC Emerging Engineers program in 2022 and currently serves on the IPC APEX EXPO technical program committee, reviewing technical content and chairing technical sessions. A contributor to the technical conference, she was awarded Best Paper in 2021.
Paige Fiet, TTM Technologies, was IPC’s first Student Director on the IPC Board of Directors. She currently serves as vice-chair of the 5-33B Solder Mask Performance Task Group and co-chair of the 7-24A Printed Board Process Effects Handbook Task Group, a member of the IPC APEX EXPO Technical Conference Program Committee and serves on an additional six standards development committees. She completed the IPC Emerging Engineer Program this year.
Christina Trussell, Blue Origin, joined the IPC/WHMA-A-620 committee in 2018. She currently serves as vice chair of the 7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group, responsible for the IPC/WHMA-A-620 Space Addendum. Trussell also participated as a judge for the 2021 IPCEF Scholarships and served on a career panel for high school and college students at the 2021 APEX EXPO virtual event. She completed the IPC Emerging Engineer Program this year.
“We are thrilled to recognize the accomplishments of our Rising Stars and to take this opportunity to thank them for their contributions,” said John W. Mitchell, IPC president and CEO. “We are privileged that Sarah, Paige, and Christina have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Indium Corporation Earns Mexico Technology Award for New Halogen-Free Flux-Cored Wire
09/18/2025 | Indium CorporationIndium Corporation recently earned a Mexico Technology Award for its new high-reliability, halide- and halogen-free flux-cored wire, CW-807RS, which improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.