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Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging

Electronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.

By reusing harvested parts, manufacturers also bypass the energy-intensive process of semiconductor fabrication, making salvaging a more sustainable alternative. This is especially valuable for complex semiconductor devices that require significant resources. Nonetheless, proper handling, inspection, and testing are essential to confirm that salvaged components remain reliable for reuse. Potential risks include physical damage, electrostatic discharge (ESD) sensitivity, moisture sensitivity level (MSL), and prior environmental exposure.

Pre-baking
Baking PCB assemblies before component removal is critical in preventing moisture-related damage. Over time, moisture can become trapped in sensitive devices, and if it vaporizes during desoldering or reflow, it can cause internal cracking, delamination, or the phenomenon known as “popcorning.” Pre-baking drives out this moisture, preserving the functional integrity of components and ensuring compliance with IPC-J-STD-033 moisture mitigation standards.

Component Removal
Component removal must be performed with precision using a controlled heat source to preserve device integrity. The primary methods are hot air rework systems and infrared (IR) rework systems.

• Hot air systems: These deliver a directed stream of heated air to raise both the component and the surrounding PCB to solder reflow temperature. Operators must carefully manage airflow, temperature, and dwell time to prevent thermal damage or PCB warping. Preheating the board before removal reduces thermal shock and helps maintain component reliability.
• Infrared systems: These radiate heat directly into the component, minimizing thermal exposure to nearby devices. However, this method is dependent on component color, reflectivity, and board material. Precise calibration and thermal profiling are critical to avoid overheating or incomplete reflow.

Regardless of the method, adherence to moisture sensitivity device (MSD) handling procedures per IPC-J-STD-033 is essential to prevent component failure. In addition, thermal profiling must be performed to ensure heating remains within manufacturer-recommended specifications.

When selecting a rework system, operators should evaluate several factors in advance:

• Is the PCB itself to be preserved, or is it scrap?
• Will the PCB thickness present challenges for achieving proper reflow?
• What materials and characteristics does the component have?
• Answering these questions helps determine which rework method will deliver the best results with minimal risk.

Component Reconditioning
Once removed, components must be reconditioned to restore leads, pads, or solder balls and prepare them for reuse. This can be performed manually or using robotic hot solder dip (RHSD) systems, particularly for ball grid array (BGA) devices. Reconditioning typically involves removing the original solder balls to expose the interposer pads, cleaning and preparing the pads to remove oxidation, accurately placing new solder balls, and performing controlled reflow and cooling. Nitrogen-assisted reflow is often recommended for high-reliability applications.

Inspection and quality control are essential at this stage. Coplanarity verification, Z-height measurement, and checks for missing, misaligned, or insufficient solder volume help ensure reliability. Detection of shorts, foreign object debris, or hidden defects via X-ray or endoscopic inspection adds an extra layer of assurance. Optional solderability testing according to IPC-J-STD-002 can confirm wetting and alloy compatibility, ensuring the component is ready for reuse.

Cleaning and Moisture Control
After reconditioning, it’s essential to clean components with appropriate aqueous or solvent-based methods to remove flux residue and contaminants. A post-cleaning bake-out per IPC-J-STD-033 is critical to eliminate absorbed moisture, preventing popcorning during any subsequent reflow in new assemblies.

Component Reclamation
Effective reclamation relies on specialized tools and trained operators. Professional soldering stations, hot air or IR rework systems, RHSD machines, optical and X-ray inspection systems, cleaning systems, bake ovens, and ESD-safe hand tools and fixtures all play a role. Operators must consistently follow MSD handling per J-STD-033 and ESD protocols, such as ANSI/ESD S20.20, to avoid component damage.

Salvaging efforts focus on high-value or long-lead-time parts, primarily surface mount devices including BGAs, LGAs, QFNs, specialty ICs, and other high-reliability components. Properly reconditioned and tested, these components can be reused in new PCB assemblies, helping reduce lead times, lower manufacturing costs, and decrease environmental impact.

Post-reconditioning Processing
Reclaimed components require proper labeling, packaging, and storage to maintain traceability and quality. Laser marking ensures identification, while packaging options like EIA-481 tape-and-reel or JEDEC trays protect the devices. Storage in vacuum-sealed, moisture-barrier bags with desiccants and moisture indicator cards, along with controlled temperature and humidity per IPC-J-STD-033, preserves component integrity until they are ready for reuse.

When outsourcing reclamation, select partners with proven experience in BGA and high-value component salvaging. They should demonstrate adherence to MSD, ESD, and environmental, occupational, and safety (EOS) standards, ensuring reliable results that meet industry expectations.

Associated Risks
Reusing salvaged components from previously assembled printed circuit boards (PCBs) carries risks that can compromise both the reliability and safety of the final assembly. Components from old or discarded boards may have been subjected to electrical overstress, excessive thermal cycling, environmental contamination, or mechanical damage during prior service life. Even if the component appears physically intact, unseen degradation—such as microcracks in solder terminations, weakened leads, or subtle shifts in electrical characteristics—can lead to early failure in the new product.

There are several testing options to reduce the risks associated with the reuse of salvaged components.

Conclusion
Electronic component salvaging is more than a cost-saving strategy; it is a cornerstone of sustainable electronics manufacturing. By reclaiming high-value components from end-of-life products, manufacturers strengthen supply chain resilience, reduce electronic waste, conserve energy, and accelerate product development cycles.

Success depends on executing each stage of the process with precision. Pre-baking, controlled component removal, careful reconditioning, thorough cleaning, and proper post-processing are all critical steps that ensure salvaged parts meet the stringent reliability requirements of modern PCB assembly. Just as important, comprehensive component testing—including electrical validation, X-ray inspection, solderability testing, and parametric verification—is vital in identifying latent defects. By confirming that salvaged parts meet performance and reliability specifications, manufacturers reduce the risk of failures that could otherwise compromise assembly quality or long-term field performance.

Adherence to established IPC standards such as J-STD-033, J-STD-002, ANSI/ESD S20.20, and industry best practices safeguards both component integrity and operator safety. Strategic partnerships with experienced reclamation providers further enhance the reliability and efficiency of the process, ensuring that component salvaging remains a trusted, sustainable, and forward-looking approach to modern electronics manufacturing.

This column originally appeared in the September 2025 issue of SMT007 Magazine.