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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC SummerCom to Co-Locate with EWPTE
January 31, 2023 | IPCEstimated reading time: Less than a minute

The IPC SummerCom Standards Development Committee Meetings will be held in-person, from May 13–18, 2023, at the Wisconsin Center in Milwaukee, Wisconsin. IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE), the industry’s exclusive trade show for decision-makers who design, specify, purchase, install, sell, maintain or manufacture electronic cable assemblies, cord sets, wiring harnesses, and other related products.
IPC SummerCom is all about IPC Standards—welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Moreover, registering to IPC Summercom provides attendees free access to EWPTE. The IPC Standard Development Committees cover a range of topics, including assembly and joining; assembly equipment, base materials, cleaning and coating; electronic product data description; embedded devices; flexible and rigid-flex printed boards; management; printed electronics; and more.
For more information or to register, contact Kim DiCianni, CEM, at KimDiCianni@ipc.org, or visit https://www.ipc.org/event/ipc-summercom.
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