Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Matrix Electronics Announces Next Generation of PCB and IC Substrate Manufacturing Automation Equipment From Advanced Engineering
February 2, 2023 | Matrix ElectronicsEstimated reading time: 1 minute
Matrix Electronics and Advanced Engineering (AE) are pleased to announce the availability of a new generation of automated robot handling and peeler systems for the Printed Circuit Board and Integrated Circuit Substrate manufacturing industries.
Advanced Engineering continues to impress the PCB industry with their inventive PCB and now IC Substrate automation solutions. Offering a complete automation equipment and software solution from their specialized shop in Hallein, Austria, the AE engineering teams are focused on accelerating production for their customers with consistency and accuracy.
“We are impressed with the willingness of North American PCB manufacturers to adopt and ramp up automation in their plants. The PCB industry is strong in North America and Matrix is looking for innovative ways to support the growth of our customers,” says Kieran Healy, President of Matrix Electronics. “New equipment designs from Advanced Engineering including the MOJO, Servant, and Peeler devices take PCB manufacturing to the next level for our customers. This advanced automation approach to PCB manufacturing reduced costs, ensures consistency and quality while optimizing plant capacity.”
Advanced Engineering harnesses the latest software and component technology from well-known manufacturers such as BECKHOFF, SICK, KEYENCE, PILZ and FESTO. All machines link directly to an MES or ERP system, giving customers superior data collection and reporting. The intelligence gathered from these systems is fed back into process engineering to optimize productivity and efficiency of the line.
“Advanced Engineering is focused on innovation with our new approach to PCB and IC Substrates Manufacturing Automation. At Advanced Engineering, we worked from the ground up to Re-imagine, Re-define, and Re-invent our equipment offering to provide lasting excellence in automated equipment and software solutions for our customers,” says Advanced Engineering CEO Johannes Steinberger. “The result is an innovative, cleaner, faster and more robust industry 4.0 compliant PCB automation manufacturing solution.”
Reduced power consumption, HEPA filtration, along with an updated touch panel interface powered by easily customizable “Line Controller” Software are important integrations in the Advanced Engineering lineup. Several Laser Direct Imaging (LDI), Automated Optical Inspection (AOI), Inkjet, Loaders and Unloaders, Buffer systems, and Develop Etch, Strip (DES) and Strip, Etch, Strip (SES) lines can be directly linked to the Line Controller making complex processes simple while bridging the gap between automated machinery and a Manufacturing Execution System (MES).
For further information visit www.matrixelectronics.com.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.
Ventec Evaluates US Manufacturing Facility to Support North American Growth
04/28/2026 | Ventec International GroupVentec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
EDADOC: Building the ‘Neural Hub’ for High-Compute Chips Within a Compact Space
04/28/2026 | ECIOEvery chip to the market must pass a stringent checkpoint before shipment known as ATE testing. Serving as the physical “neural hub” that connects test equipment worth millions of dollars with the device under test, the performance of the ATE test board directly determines the accuracy, efficiency, and final yield of chip testing. Amid the rapid rise of high-compute chips, what extreme challenges is this seemingly small circuit board facing? How is EDADOC addressing industry pain points through its one-stop “design + manufacturing” model?
American Made Advocacy: Rebuilding America’s Military Stockpiles Begins With Microelectronics
04/28/2026 | Shane Whiteside -- Column: American Made AdvocacyCurrent world events demonstrate the fragility of long-distance supply chains transiting multiple zones of conflict. The U.S. military is currently drawing down supplies of key munitions and other electronic systems at unprecedented rates.1Every one of those systems is powered by printed circuit boards. The American PCB industry has kept pace with peacetime demand for the defense industry, but will now be called upon to increase production to a wartime footing at rates not seen in decades.