It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
Alpha Insights, Performance by Design: The Future of PCB Manufacturing in the Midwest
Happy’s Tech Talk #43: Engineering Statistics Training With Free Software
DesignCon 2023 Opens With Strong Attendance
February 2, 2023 | Andy Shaughnessy, Design007Estimated reading time: 1 minute
As George Costanza would say, “DesignCon is back, baby!”
The show opened Wednesday morning, and it really felt like old times again. The aisles of the Santa Clara Convention Center were busy, and the classrooms for the technical conference were nearly full. And I spoke—or tried to speak—with quite a few engineers who spoke almost no English. That’s a good sign; in recent years, there were very few attendees from outside the U.S. because of Covid restrictions. The Pacific Rim is well represented this year.
The welcome reception Tuesday night was literally packed inside the Santa Clara Grand Ballroom. There must have been 150 people eating tacos and drinking IPAs and wine. It was so loud that you couldn’t hear the person next to you. Good problem to have, though!
AI is in the spotlight at DesignCon 2023. The Chiphead Theater hosted a panel on AI in EDA tools. One of the main challenges seems to be getting AI from proof of concept into production. Everyone agrees that AI has a role in EDA, but how to get there is up for discussion. But EDA companies are demonstrating their tools’ AI functionality this week, particularly in simulation and analysis software. AI is here to stay.
This is a good omen for the rest of 2023. People are ready to get back to in-person trade shows and conferences. To use an overused turn of phrase, it seems like old times, but with the latest technology.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Pulsonix 14.0 Adds Embedded Simulation, Smarter 3D Views, Enhanced Workflow
10/08/2025 | PulsonixPulsonix, the EDA company delivering technology-leading PCB design solutions, is proud to announce the launch of Pulsonix 14.0, its latest PCB design software platform.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/06/2025 | Nolan Johnson, I-Connect007Maybe you’ve noticed that I’ve been taking to social media lately to about my five must-reads of the week. It’s just another way we’re sharing our curated content with you. I pay special attention to what’s happening in our industry, and I can help you know what’s most important to read about each week. Follow me (and I-Connect007) on LinkedIn to see these and other updates.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
Siemens Leverages AI to Close Industry’s IC Verification Productivity Gap in New Questa One Smart Verification Solution
05/13/2025 | SiemensSiemens Digital Industries Software announced the Questa™ One smart verification software portfolio, combining connectivity, a data driven approach and scalability with AI to push the boundaries of the Integrated Circuit (IC) verification process and make engineering teams more productive.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.