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Frequency Electronics Wins $8 Million Space Mission Contract

07/27/2026 | Globe Newswire
Frequency Electronics, Inc., a leading provider of precision timing and frequency control products for space and terrestrial applications, is pleased to announce the award of a follow-on production contract for approximately $8 million, for compact, highly precise atomic clocks to support position, navigation, and timing (PNT) for lunar space missions.

Beyond the Board: Diversification as Strategy

07/22/2026 | Marcy LaRont, I-Connect007 Magazine
Are the days of simply building boards and shipping them out the door coming to an end? For PCB fabricators and electronics manufacturers alike, diversification is moving from a growth strategy to one of survival. Supply chain disruptions, geopolitical uncertainty, tariff fluctuations, and accelerating technology cycles are forcing companies to rethink how they create value for customers. At Flexible Circuit Technologies (FCT), that has meant expanding beyond world-class flex circuit manufacturing into assembly, vertical integration, and a growing global footprint.

Intel, Google Cloud Announce Collaboration to Accelerate Intel’s AI-Enabled Enterprise Transformation

07/21/2026 | Intel Corporation
Intel and Google Cloud announced an expansion of their previously announced multi-year strategic collaboration, which would accelerate Intel’s enterprise-wide digital evolution through the deployment of Gemini Enterprise and Google Cloud.

Foxconn Conducts 85 RBA VAP Audits, Earns Six Platinum Certifications

07/14/2026 | Foxconn
Foxconn Technology Group continues to deepen its core concept of "EPS + ESG = Sustainable Operation" and released its latest annual third-party audit summary report.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.
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