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Real Time with... IPC APEX EXPO 2023: Automotive Electrification
February 8, 2023 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Nolan Johnson talks with Senior Product Manager Chris Nash of Indium Corporation, who discusses Durafuse LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our Real Time with... IPC APEX EXPO show page.
Suggested Items
Dr. Jennie Hwang to Deliver Two PDCs at IPC APEX
02/04/2025 | Dr. Jennie HwangDr. Jennie Hwang, Chair of the AI Committee of National Academies/DoD AI study, Chair of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course.
TopLine Bringing Answers, New Ideas to APEX 2025
02/04/2025 | TopLineTopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.
Rehm Thermal Systems: Future Technologies for Coating, Dispensing and Vapour Phase Soldering Live at IPC APEX EXPO 2025
02/04/2025 | Rehm Thermal SystemsIPC APEX EXPO 2024, which takes place from 18 to 20 March at the Anaheim Convention Center in California, is the largest and most important trade fair for electronics manufacturing in North America.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.