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IPC Introduces New Committee Leader and Committee Volunteer Awards at IPC APEX EXPO 2023
February 8, 2023 | IPCEstimated reading time: 1 minute
In keeping with its commitment to showing appreciation for its strong volunteer community, IPC introduced two new awards in IPC standards development at IPC APEX EXPO 2023. The awards, Committee Leader of the Year and Volunteer of the Year, were named in honor of key leaders and volunteers from IPC standards development efforts. The Hillman-Lambert Award, named for IPC Hall of Famers and longtime standards committee volunteers David Hillman and Leo Lambert, is awarded to volunteers of the year. The Goldman-Kessler Award, named for IPC Hall of Famers, and longtime committee leaders, Patty Goldman and Bernie Kessler, is awarded to leaders of the year.
Nominations for the 2023 awards were open to all volunteers and leaders whose groups had completed their standards projects between October 2021 and October 2022. The awards were peer-selected, and a nomination committee was formed to review and judge all nomination packets.
The Hillman-Lambert Award was presented to Michael Ford, Aegis Software, and Christina Rutherford, Honeywell International, as the result of a tie vote. Ford received his nomination for his work with the 2-12c Cybersecurity Protection Standard Task Group. Rutherford was nominated for her work with the 7-31f IPC/WHMA-A-620 Task Group.
The Goldman-Kessler Award was presented to Bob Cooke, NASA Johnson Space Center. Cooke was nominated for his leadership of the 7-31k Wire Harness Design Task Group and the 5-24g Polymerics Standard Task Group.
In addition to Ford and Rutherford, nominees for the Hillman-Lambert Award included Erika Crandall, TE Connectivity; Hermann Eicher, EPT Guglhoer GmbH; Joseph Kane, BAE Systems; Garry McGuire, NASA Marshall Space Flight Center; Zhiqian Sang, Hangzhou Dianzi University; and Wei Wang, New HC3 Technologies Co., Ltd.
In addition to Cooke, nominees for the Goldman-Kessler Award were: Scott Bowles, Lockheed Martin; Constantino Gonzalez, Acme Training and Consulting; Thomas Marktscheffel, ASMPT GmbH & Co. KG; and Victor Xu, Huawei Technologies Co., Ltd.
“Volunteerism is the bedrock of our standards development activities,” said Teresa Rowe, IPC senior director, assembly and standards technology. “The new standards development committee awards program is entirely volunteer-driven, created to recognize the best-of-the-best in our standards development activities.”
Committee Leader and Volunteer of the Year awards will be presented on an annual basis, with next presentation taking place at IPC APEX EXPO 2024 in Anaheim, California.
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Julia McCaffrey - NCAB GroupSuggested Items
TTC-LLC and TTCI: Smarter Training, Stronger Test at PCB East 2026
04/27/2026 | The Test Connection Inc.The Training Connection LLC (TTC-LLC) and The Test Connection, Inc. (TTCI) will be exhibiting together at PCB East 2026, taking place April 28–May 1 at the DCU Convention Center in Worcester, Massachusetts. Attendees can find both teams at Booth #103 during the main exhibition day on Wednesday, April 29.
Building Industry-ready Talent Through Standards-based Education
04/27/2026 | Global Electronics AssociationRecently, Sichuan Modern Vocational College organized 132 students to complete IPC-A-610 Acceptability of Electronic Assemblies Certified IPC Specialist (CIS) training and certification.
Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies
04/27/2026 | Nolan Johnson, I-Connect007This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyaki, Divyash Patel, CEO of MX2 Technologies, and Ali Pabrai, CEO at EC First, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.