Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Winners of IPC Hand Soldering Competition at Southern Manufacturing & Electronics 2023 Announced
February 14, 2023 | IPCEstimated reading time: 1 minute
In conjunction with Southern Manufacturing & Electronics 2023, IPC hosted the UK regional Hand Soldering Competition in Farnborough, UK, February 7-9, welcoming 27 competitors from 20 European electronics companies. Skilled contestants competed to build an assembly in accordance with IPC-A-610 – Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality. Contestants were allowed a maximum of one hour to complete the process.
On the winner’s podium were:
First Place: Returning first prize winner, Justyna Mikolajzcyk, Zettlex, with 537 points from a possible 558, with a time of 55 minutes,10 seconds. She received a certificate, a cash prize of 300 EUR, and a gift from sponsor Almit. As the winner, Mikolajzcyk qualified for the IPC Hand Soldering World Championship at productronica in Munich, Germany in November 2023.
Second place: Przemyslaw Marszalek, TVC, with a total of 533 points completing his board in 51 minutes, 07 seconds. He received a certificate, a cash prize of 200 EUR, and a gift from sponsor Almit.
Third Place: Rich Barlow, GAITQ, Ltd., with a total score of 524 points, completing in a time of 56 minutes, 07 seconds. He received a certificate, a cash prize of 100 EUR, and a gift from sponsor Almit.
Best Company Team Award
The Best Company Award, determined by the best scores of the contestants from that company, was presented to Dyson Technology, Ltd, with three competitors achieving the best team performance in the competition.
IPC is grateful to the HSC sponsors for their generous support:
- Gold sponsors: Weller Tools, Thales
- Silver Sponsors: Almit, Ateliers Systems, NCAB Group, Optilia, Polygone CAO, Societe Francaise de Microscopie (SFM)
“IPC thanks and congratulates all the participants and their companies for their interest and for taking up the hand soldering challenge,” said Philippe Leonard, managing director, IPC Electronics Europe GmbH. “We look forward to a full year of exciting competitions, culminating in the World Championship in Munich later this year.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
TTM Technologies Receives Two Awards from the Global Electronics Association at the 2025 IPC CEMAC Conference
11/03/2025 | Globe NewswireTTM Technologies, Inc. announced that two of its team members received prestigious Asia Steering Committee Outstanding Service Awards from the Global Electronics Association (formerly named IPC connecting global electronics industry) at the 2025 IPC CEMAC Electronics Manufacturing Annual Conference in Shanghai.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.