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Meet with KYZEN at the MCA How Clean Is Clean – Aerospace Expo
February 20, 2023 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the MCA How Clean Is Clean – Aerospace Exhibition, scheduled to take place Tuesday, March 7, 2023, at the Jackson Center in Huntsville, Alabama. The KYZEN team will discuss the benefits of its METALNOX M6920 VOC Free Solvent Cleaner, METALNOX M6386 Modified Alcohol Solvent Cleaner and METALNOX M6381 Precision Hydrocarbon Solvent Cleaner.
METALNOX M6920 is a highly effective VOC free cleaning solution intended for use in vapor degreasing equipment, cold cleaning and manual cleaning, and is a suitable replacement for AK225. It has proven compatible with a variety of metal parts, such as stainless steel, copper, iron, aluminum, and titanium. METALNOX M6920 also works well with alloys used in precision cleaning industries such as aerospace, automotive, medical, electronics and defense.
METALNOX M6386 is a modified alcohol-based solvent blend designed for use in automated vacuum degreasing parts cleaning machines. The cleaner is highly effective on paraffinic and water-based oils, cutting fluids and milling fluids commonly used to forge and cast metal hardware, fasteners and components.
METALNOX M6381 is a hydrocarbon solvent cleaner formulated for use on non-polar soils and is commonly used to clean parts supplied to the automotive, medical, aerospace, and other high-tech industries. M6381 is most effective in vacuum degreasing, immersion, and manual applications.
As several traditional degreasing solvents face drastic exposure limit restrictions, KYZEN has safe and effective alternatives. KYZEN'S cleaning experts can evaluate your current cleaning process and parameters to help you choose products that will be a good fit with your process, as well as satisfy your cleanliness standards. METALNOX M6920, M6381 and M6386 meet U.S. EPA requirements for your vacuum and vapor degreasing cleaning processes.
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Brent Fischthal - Koh YoungSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.