-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Altus: Leading CEM Invests in High Performance Laser Depaneling System to Future-Proof Production
February 23, 2023 | Altus GroupEstimated reading time: 2 minutes

Laser depaneling is one of the most advanced techniques for cutting and separating PCBs from the panel today and is changing how electronic components are manufactured. To ensure production is futureproofed, and products are manufactured to the highest quality, leading CEM, Sellectronics has invested in an innovative system from Altus Group to assist in the process.
The LPKF CuttingMaster 2240 system has the capability to laser depanel to the highest tolerances. It offers significant advantages compared to conventional mechanical separation methods thanks to its flexibility and stress-free methods.
Working closely with leading OEMs, Sellectroinics sees a wide range of PCB designs that require precise solutions. The LPKF CuttingMaster significantly improves depaneling efficiency with increased cutting speeds of up to 25% on all quality levels depending on the specific application.
Jason O’Connell, Sellectronics Technical Director, said: “Integrating the latest innovative technology and equipment into our operations is fundamental in ensuring we consistently manufacture the very best products and do not miss any business opportunities.
“Sellectronics continue to look at future trends and invest in our production line to help support our customers in the coming years. We are seeing more and more populated rigid and flexible PCBs, sensitive parts, and complex miniaturised assemblies in varying materials. By investing in the LPKF CuttingMaster we can effectively produce components of today and also have the capability to produce those of tomorrow, as the equipment gives us the flexibility and scalability to always stay ahead.”
Joe Booth, Altus CEO, added: “Sellectronics is an excellent example of a company looking to the future and investing their money wisely to offer short-term results but long-term risk mitigation and value to their customers. This investment has put them in a pool of a handful of CEMs in the UK and Ireland who have invested in a process that will give them a significant competitive edge, which is a considerable advantage within the electronics industry.”
The LPKF CuttingMaster 2240 is the first laser system with ultra-fast Tensor Technology which sets a new standard in laser processing. Tensor is a highly innovative beam deflection module developed to distribute pulses around the laser spot in a targeted manner. This enables significantly higher laser powers to be used effectively and meets the highest requirements. Importantly, Tensor increases the quality of the PCB as cooling times are no longer necessary due to an ultra-fast beam guidance system.
The system offers a very attractive price-performance ratio, and with the added Tensor the available power is optimally utilised leading to a significant increase in efficiency. This innovative technology enhances with increasing material thickness, particularly with technically clean cuts. LPKF CuttingMaster 2240 sets new standards in terms of performance, technical cleanliness, and efficiency of depaneling.
Suggested Items
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Hon Hai Research Institute Achieves Breakthrough in Quantum Cryptography Recognized by Leading Global Conference
06/17/2025 | FoxconnHon Hai Research Institute (HHRI), the research arm of Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer and technology service provider, has achieved a significant breakthrough in quantum computing.
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
06/17/2025 | Marcy LaRont -- Column: Marcy's MusingsThis month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.
Adeon Technologies Signs Agreement as Distribution and Service Partner for PMT Global
06/13/2025 | Adeon Technologies BVAdeon Technologies has signed an agreement as Distribution and Service partner with PMT Global from Germany for its high precision measurement range of products.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd