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Integr8tor and UcamX v2023.01 are Now Available
March 6, 2023 | UcamcoEstimated reading time: Less than a minute
Ucamco is proud to release Integr8tor v2023.01 and UcamX v2023.01. These new versions of our Pre-CAM and CAM software include plenty of additions to increase our customers’ productivity, highlighted by the topics below.
Integr8tor v2023.01
- Yellow solder mask color
- Plated/non-plated/backdrill-to-copper clearance analysis
- Conditional formatting
- Agile job queue handling
- Performance and security
- DPMX import
UcamX v2023.01
- YELO Mask Adjuster
- Object Summary Table
- Magnifier II
- Rout Manager
- Input GDSII
- SmartTest
- CAD Output Gerber X2/X3
- Input Drill/Rout
- Check for update
Integr8tor and UcamX v2023.01 are now available for download for all maintenance contract users. Customers who wish to upgrade to this version outside of a maintenance contract or wish to take out a maintenance contract.
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Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.