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I-Connect007 Launches New Micro Webinar Series: ‘Smarter Manufacturing Enabled with Inspection Data,’ Presented by Koh Young
March 13, 2023 | I-Connect007Estimated reading time: Less than a minute

Watch & learn!
In this engaging, 12-part micro webinar series, Koh Young topic expert Ivan Aduna examines the role inspection systems will play in the next industrial revolution. Viewers will learn about secure data collection, AI-powered solutions to manage and analyze data, and how to leverage IPC CFX-QPL to succeed in the transformation to Industry 4.0.
The first episode, “Smart Factory Success” is now available to view. In this 4-minute segment, viewers will discover how inspection systems and proprietary AI-based learning technologies incorporate the industry’s best True 3D measurement-based technologies. Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, throughout the series, presenter Ivan Aduna shares highly focused educational information on the use of data gathered during the inspection process.
This webinar series covers a comprehensive range of topics surrounding 3D inspection and process control. Each segment clocks in at around 5 minutes, with the entire series being viewable in under an hour.
Visit Smarter Manufacturing Enabled with Inspection Data and start watching, free, today!
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.