It’s Only Common Sense: Be the Solution, Not the Problem
American Made Advocacy: Long-time Challenges Confront a New Administration
Marcy's Musings: It's Show Time!
I-Connect007 Launches New Micro Webinar Series: ‘Smarter Manufacturing Enabled with Inspection Data,’ Presented by Koh Young
March 13, 2023 | I-Connect007Estimated reading time: Less than a minute
Watch & learn!
In this engaging, 12-part micro webinar series, Koh Young topic expert Ivan Aduna examines the role inspection systems will play in the next industrial revolution. Viewers will learn about secure data collection, AI-powered solutions to manage and analyze data, and how to leverage IPC CFX-QPL to succeed in the transformation to Industry 4.0.
The first episode, “Smart Factory Success” is now available to view. In this 4-minute segment, viewers will discover how inspection systems and proprietary AI-based learning technologies incorporate the industry’s best True 3D measurement-based technologies. Designed to complement Koh Young’s I-007eBook, The Printed Circuit Assembler’s Guide to... SMT Inspection, Today, Tomorrow and Beyond, throughout the series, presenter Ivan Aduna shares highly focused educational information on the use of data gathered during the inspection process.
This webinar series covers a comprehensive range of topics surrounding 3D inspection and process control. Each segment clocks in at around 5 minutes, with the entire series being viewable in under an hour.
Visit Smarter Manufacturing Enabled with Inspection Data and start watching, free, today!
Share on:
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.
Hannah Nelson: The Inspiring Journey of an Emerging Engineer
03/11/2025 | I-Connect007 Editorial TeamAt last year’s IPC APEX EXPO, former IPC Emerging Engineer Hannah Nelson had the opportunity to reflect on her inspiring journey into the world of engineering, from her education at Valparaiso University to her internship and her first job at Texas Instruments. From pivotal moments and the unexpected turns that helped shape her early career and passion for electrical engineering, her story highlights the importance of interdisciplinary collaboration, taking opportunities that arise early on, finding confidence in one's voice, and the rewards of pursuing one's passions within the engineering field.