-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Women at Scanfil Initiated Support for the Children in Turkey and Syria
March 8, 2023 | ScanfilEstimated reading time: 1 minute

In honor of International Women’s Day, Scanfil’s Women Appreciation Team (SWAT) initiated support for children affected by the earthquake in Turkey and Syria. The team is driving positive change at Scanfil and beyond, empowering women and advocating for inclusivity. Through their dedication and hard work, the SWAT team is leading the way towards a brighter, more equitable future for all.
The Scanfil Women Appreciation Team (SWAT) is a group of Scanfil employees who have a mission to enhance equality and diversity at Scanfil through women empowerment. The community unites women from all Scanfil locations into a valuable network driving Women Empowerment Principles from UN Global Compact.
“The group was founded in 2022, after Scanfil became the Signatory of Women Empowerment Principles as defined by UN Global Compact. The SWAT Team meets monthly to discuss how to enhance gender equality and inclusivity at Scanfil”, tells Malgorzata Klimkowska, Global Human Resources Director and the chairperson of SWAT, and continues “I am proud to tell that we have initiated many great and successful activities in 2022, and I am excited to continue the work in 2023”.
Based on a SWAT Team’s proposal, Scanfil has decided to donate money to UNICEF to celebrate The International Women’s Day
In addition to internal initiatives, the team is also driving charity initiatives. To celebrate the International Women’s Day and based on SWAT’s proposal, Scanfil has decided to donate money to UNICEF for the humanitarian aid supporting women and children affected by the earthquake in Turkey and Syria.
We decided to donate funds to UNICEF and support their actions:
- To ensure that the affected children and families have access to safe drinking water and sanitation services – critical in preventing illness in the early days of a crisis,
- To identify separated and unaccompanied children and work to reunite them with their families, as well as provide children with psychological first aid,
- And coordinating the nutrition responses, especially for young children under 2 years and pregnant women of the displaced population in Syria. They are mobilizing essential nutrition supplies from across the region and delivering essential health and nutrition services through?mobile teams.
We are proud to have such a talented and motivated group of people to driving equality initiatives and supporting organizations such as UNICEF that make the difference.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/12/2025 | Marcy LaRont, I-Connect007We may be post-Labor Day, but it is still hot-hot-hot here in the great state of Arizona—much like our news cycles, which have continued to snap, crackle, and pop with eye-raising headlines over this past week. In broader global tech news this week, AI and tariff-type restrictions continues to dominate with NVIDIA raising its voice against U.S. lawmakers pushing chip restrictions, ASML investing in a Dutch AI start-up company to the tune of $1.5 billion, and the UAE joining the ranks of the U.S. and China in embracing “open source” with their technology in hopes of accelerating their AI position.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.