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The March 2023 Issue of PCB007 Magazine Is Now Available
March 15, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Points of View
When logging in to a popular social media account, the first thing you get asked is: What’s on your mind? It’s such a great question because it’s so open-ended. There’s no judgment, no general direction, no expectation. We just get to share what we’re thinking about.
Well, we’re three months into 2023, and wrapping up our first quarter. So, as a PCB fabricator, what’s on your mind? Is it time to assess, and perhaps reassess, your expectations for the year and whether your reality is meeting your predictions? What are you hopeful about? What’s making you nervous? What are the opportunities and the obstacles to your business right now?
Several trends and challenges seem to be prevalent today: reshoring, high reliability, increased capacity, staffing, new capabilities, and the CHIPS Act. As you’ll see in the March 2023 issue of PCB007 Magazine, we touch on all those topics, as well as a few surprises.
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Suggested Items
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
05/01/2025 | Team NCAB -- Column: Fresh PCB ConceptsAs a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
INEMI Call-for-Participation Webinar: BiSn-Based Low-Temperature Soldering Process and Reliability Project Phase 3b
04/28/2025 | iNEMIIn 2015, INEMI initiated the BiSn-Based Low-Temperature Soldering Process and Reliability Project to assess the feasibility of using low-temperature solders (LTS) in the SnBi system to address various technological, economic and ecological drivers for assembly of consumer computer electronic board products.
Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
04/22/2025 | MicrochipThe JANS qualification represents the highest level of screening and acceptance requirements, ensuring the superior performance, quality and reliability of discrete semiconductors for aerospace, defense and spaceflight applications.