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The March 2023 Issue of PCB007 Magazine Is Now Available
March 15, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Points of View
When logging in to a popular social media account, the first thing you get asked is: What’s on your mind? It’s such a great question because it’s so open-ended. There’s no judgment, no general direction, no expectation. We just get to share what we’re thinking about.
Well, we’re three months into 2023, and wrapping up our first quarter. So, as a PCB fabricator, what’s on your mind? Is it time to assess, and perhaps reassess, your expectations for the year and whether your reality is meeting your predictions? What are you hopeful about? What’s making you nervous? What are the opportunities and the obstacles to your business right now?
Several trends and challenges seem to be prevalent today: reshoring, high reliability, increased capacity, staffing, new capabilities, and the CHIPS Act. As you’ll see in the March 2023 issue of PCB007 Magazine, we touch on all those topics, as well as a few surprises.
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Suggested Items
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
IDENTCO to Showcase Specialized Labels and Presenters for Electronics Component Production at IPC APEX
02/26/2025 | IDENTCOIDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will showcase its robust range of solutions for printed circuit boards (PCBs) and electronic components at IPC APEX Expo.
The Knowledge Base: Challenges and Considerations of Harsh Environments
02/26/2025 | Mike Konrad -- Column: The Knowledge BaseIn today’s rapidly advancing technological landscape, electronic assemblies are increasingly being deployed into environments that push their design and material limits. From the corrosive atmospheres of industrial facilities to the extreme temperatures and humidity of outdoor applications, harsh environments present a significant challenge to the reliability of electronic devices. This column explores the key issues impacting electronics reliability in such conditions, including electrochemical migration (ECM), corrosion, and the role of residue tolerance in assembly design.
Axxon-Mycronic to Showcase Advanced Coating, Dispensing, and Backend Solutions at IPC APEX EXPO 2025
02/19/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, to announce its participation at the IPC APEX EXPO 2025, taking place March 18-20, 2025 at the Anaheim Convention Center.
MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics
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