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This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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The March 2023 Issue of PCB007 Magazine Is Now Available
March 15, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Points of View
When logging in to a popular social media account, the first thing you get asked is: What’s on your mind? It’s such a great question because it’s so open-ended. There’s no judgment, no general direction, no expectation. We just get to share what we’re thinking about.
Well, we’re three months into 2023, and wrapping up our first quarter. So, as a PCB fabricator, what’s on your mind? Is it time to assess, and perhaps reassess, your expectations for the year and whether your reality is meeting your predictions? What are you hopeful about? What’s making you nervous? What are the opportunities and the obstacles to your business right now?
Several trends and challenges seem to be prevalent today: reshoring, high reliability, increased capacity, staffing, new capabilities, and the CHIPS Act. As you’ll see in the March 2023 issue of PCB007 Magazine, we touch on all those topics, as well as a few surprises.
Subscribe here for delivery in your e-mailbox.
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Simon Khesin - Schmoll MaschinenSuggested Items
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SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
SEL Showcases Global Factories and Product Development Journey for Manufacturing Day
10/10/2025 | SELSEL is celebrating Manufacturing Day 2025 with the release of a new video showcasing its product development and vertically integrated manufacturing process.