-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems
March 17, 2023 | Amtech Systems, Inc.Estimated reading time: 1 minute
Amtech Systems, Inc., a manufacturer of capital equipment, including thermal processing, wafer polishing, cleaning and related consumables and services used in fabricating semiconductor devices, such as silicon carbide (SiC), silicon power, and electronic assemblies with a focus on enabling technologies for electric vehicles (EV) and clean energy applications, announced a multi-unit order for high volume reflow systems used in advanced packaging applications.
This order, valued at $1.8M, came from a leading OSAT customer of BTU International and will begin shipping this month through the third fiscal quarter of fiscal 2023. With this, the total number of units ordered by this key customer is over 300. The Pyramax reflow oven is the oven of choice for outsourced semiconductor assembly and test (OSAT) due to its combination of extreme control of thermal and atmosphere conditions at very high throughput.
“While the semiconductor industry is undergoing a period of uncertainty, we are encouraged by this recent order that serves the advanced computing market,” said Michael Whang, CEO of Amtech Systems. “Our relationships with key customers in the OSAT sector are ones we are particularly proud of – and in passing the 300-unit milestone with this customer, it’s a credit to the entire team responsible for this account,” added Whang.
Suggested Items
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.
Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024
11/19/2024 | Yamaha Robotics SMT SectionYamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.
RTX's Raytheon Awarded U.S. Army Contract for Wireless Power Beaming Technology
11/18/2024 | Raytheon TechnologiesRaytheon, an RTX, has been awarded a contract from the U.S. Army to work on directed energy wireless power beaming capabilities that will distribute power across the battlefield, simplify logistics, and safeguard locations for U.S. troops.
Biden-Harris Administration: Akash Systems to Support Emerging Semiconductor Technology
11/14/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the Department of Commerce and Akash Systems have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $18.2 million in proposed direct funding under the bipartisan CHIPS and Science Act. This investment will enable the company to leverage its intellectual property and experience of developing semiconductor technologies that serve important end markets, such as communications and the defense industrial base, while also creating over 400 direct manufacturing and construction jobs.