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Imec Demonstrates 16nm Pitch Ru Lines with Record-low Resistance Obtained Using a Semi-damascene Integration Approach

06/03/2025 | Imec
At the 2025 IEEE International Interconnect Technology Conference (IITC), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents Ru lines at 16nm pitch with average resistance as low as 656Ω/µm.

OSI Systems Receives $47 Million Services Order for Security Inspection Systems

05/30/2025 | BUSINESS WIRE
OSI Systems, Inc. announced that its Security division received a $47 million order from a U.S. based customer to provide ongoing maintenance service for its installed base of Rapiscan® inspection systems that are utilized for screening baggage, cargo and vehicles.

Imec Unveils Record-Low Loss 300mm RF Silicon Interposer for Sub-THz Systems

05/27/2025 | Imec
At the IEEE ECTC 2025 conference, imec – a world-leading research and innovation hub in nanoelectronics and digital technologies – highlights the exceptional performance and flexibility of its 300mm RF silicon interposer platform.

ASMPT Presents Central Platform for Data Exchange in Electronics Manufacturing

05/21/2025 | ASMPT
With WORKS Integration, ASMPT SMT Solutions, the market and technology leader in SMT, provides a central integration platform through which all its hardware and software solutions can communicate with each other.

ITEN, A*STAR IME Announce Breakthrough in Solid-State Battery Integration for Advanced Packaging

05/15/2025 | BUSINESS WIRE
ITEN, a global leader in micro solid-state batteries, and A*STAR Institute of Microelectronics (A*STAR IME), a leader in advanced packaging research, have announced a groundbreaking achievement for the integration of ITEN’s micro batteries using A*STAR IME’s cutting-edge advanced packaging platform.
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