Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

The Knowledge Base: The Era of Advanced Packaging

12/23/2024 | Mike Konrad -- Column: The Knowledge Base
The semiconductor industry is at a pivotal juncture. As the traditional scaling predicted by Moore's Law encounters significant physical and economic barriers, transistor density can no longer double every two years without escalating costs and complications. As a result, the industry is shifting its focus from chip-level advancements to innovative packaging and substrate technologies. I Invited Dr. Nava Shpaisman, strategic collaboration manager at KLA, to provide some insight.

Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities

11/20/2024 | indie Semiconductor
indie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.

NetVia Group Invests in KLA's Frontline InCAM Pro Software

11/14/2024 | Epec
NetVia Group, a leading provider of advanced printed circuit boards (PCBs) and solutions for high-reliability industries, proudly announces its investment in and implementation of Frontline InCAM® Pro software.

NEC Launches New End to End Private 5G Solution with Cisco

10/28/2024 | JCN Newswire
NEC Corporation, a leader in the integration of IT and network technologies, is joining forces with Cisco to deliver a new private 5G network solution to their customers.

Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design

10/23/2024 | Keysight Technologies
Keysight Technologies, Inc. and Siemens EDA have teamed up to accelerate the efficiency of wireless and defense system design.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in