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Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program

04/30/2026 | Zhen Ding
Zhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.

SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026

04/30/2026 | SCHMID Group
SCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.

Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU

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SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation

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The second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.

Ventec Evaluates US Manufacturing Facility to Support North American Growth

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Ventec International Group today announced that it is evaluating the potential establishment of a manufacturing facility in the United States to support its growing North American customer base with high-performance laminate and prepreg materials.
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