Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
MKS’ Atotech to Participate in CPCA Show
March 20, 2023 | AtotechEstimated reading time: 1 minute
MKS Instruments announced its participation in the upcoming CPCA Show 2023, the international electronic circuits exhibition in Shanghai, China held from March 22-24, 2023. MKS will be present with representatives from two of its strategic brands, Atotech and ESI, and present its latest products and manufacturing solution for printed circuit board and package substrate manufacturing.
Product experts from overseas will be joining the local team and be available to discuss the latest industry trends and challenges, as well as introduce the new combined product offering consisting of PCB production equipment (wet-to-wet process equipment, laser systems, and auxiliaries), chemistry, software, and service. The company will be exhibiting at booth 7T26 and this year’s product highlights include:
- V-Plate: The new gold standard for vertical conveyor plating equipment for next-generation HDI PCB and package substrates
- InPro SAP6: The new high-end electrolyte for vertical processing of next-generation package substrates
- New Uniplate: The industry-leading horizontal plating tool for next-generation HDI PCBs and package substrates manufacturing
- Printoganth MV TP2: Next-generation electroless copper for fine-line SAP applications
- BondFilm EX: New bonding enhancement solution for low signal loss high-frequency applications
- PallaBond: Direct pure EPAG for high-end circuitry and reliability application
- CapstoneTM: Flex PCB UV drilling tool for high-performance breakthrough productivity
- GeodeTM: HDI PCB and package substrate high-precision CO2 via drilling tool
Share on:
Suggested Items
The Chemical Connection: Surface Finishes for PCBs
03/31/2025 | Don Ball -- Column: The Chemical ConnectionWriting about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.
NUS Physicists Discover a Copper-free High-temperature Superconducting Oxide
03/28/2025 | PRNewswireProfessor Ariando and Dr Stephen Lin Er Chow from the National University of Singapore (NUS) Department of Physics have designed and synthesised a groundbreaking new material—a copper-free superconducting oxide—capable of superconducting at approximately 40 Kelvin (K), or about minus 233 degrees Celsius (deg C), under ambient pressure.
AT&S Sets New Standards in the Recycling of Copper and Chemicals
03/25/2025 | AT&SAT&S has been working for years to reduce the ecological footprint of its production sites worldwide with a comprehensive sustainability strategy and considerable investments.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
Just Because You Can, Doesn’t Mean You Should
03/20/2025 | Tony Plemel, Flexible Circuit TechnologiesDecisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.