-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Chemistry & Process Control from KYZEN at the SMTA Boise Expo
March 30, 2023 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Boise Expo & Tech Forum, scheduled to take place Tuesday, April 11, 2023 at The Grove Hotel in Boise, Idaho. Visit KYZEN for answers regarding electronics cleaning challenges. Cleaning experts will be in the booth to provide a total cleaning solution.
KYZEN will be highlighting their award-winning combination of chemistry and process control. For more than 30 years, KYZEN's focus has been to look at the complete process and work with them to improve that process. Their aim is to ultimately increase yields, advance reliability and help to realize cost savings along the way. KYZEN’s newest aqueous cleaning chemistry, AQUANOX A4626, paired with the KYZEN PCS accomplishes that goal.
AQUANOX A4626 is easy-to-use and control, environmentally friendly, and has a long tank life that makes it safe for multi-pass applications. Using A4626 with the KYZEN Process Control System (PCS) to monitor and automatically react to the dynamic changes in the wash bath concentration completes the process. A4626 paired with the PCS is the perfect combination – Chemistry and Control are hard at work.
Suggested Items
TSK Schill GmbH Closes 2024 With a Record Turnover
01/14/2025 | TSK Schill GmbHAt TSK, the course continues to be set for growth. Despite the turbulent market development, we were able to increase our turnover “EBIT”. We generated a large proportion of our turnover with Solution Business.
SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.
Data Paints a Picture—Can You See It?
01/09/2025 | Marcy LaRont, PCB007 MagazineAndrew Kelley is CTO of Xact PCB, a company founded by engineers with firsthand experience in PCB fabricators. Xact PCB has developed a cutting-edge system to monitor and predict the registration of inner layers through advanced registration control systems. By leveraging data collected from various production stages, Xact PCB’s GX tool enhances precision. It minimizes errors, ensuring that the final products meet their customers' exact specifications while eliminating the need for costly pilot lots.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
Focus on electronica: Standards and the Factory of the Future
01/08/2025 | I-Connect007 Editorial TeamDr. Thomas Marktscheffel, director of product management software solutions for ASMPT, gave a presentation at electronica 2024 titled Standards Driving the Factory of the Future. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.