SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics

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Leading experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, June 26-28, 2023 in Dresden, for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent systems. The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies. Registration is open.

“We look forward to hosting industry leaders at the 3D & Systems Summit as they deliver insights into cutting-edge advanced packaging solutions,” said Laith Altimime, President of SEMI Europe. “Packaging innovations are critical to semiconductor industry growth, increasing chip performance, reducing power consumption and enabling smaller end devices for emerging and fast-growing segments including autonomous driving, 6G, Internet of Things (IoT), artificial intelligence (AI), and machine learning.”

Themed Smarter Systems through Heterogeneous Integration, this year’s 3D & Systems Summit will feature a broader scope of topics including: 

• Advanced Packaging: Enabling Moore’s Law’s – The Next Frontier
• Market Briefing and Technical Roadmap
• Industrialization and Mass Adoption of 3D Technologies
• Hybrid Bonding Developments
• Chiplet Design Packaging: Architectures and Challenges
• Novel Processes and Interconnect Solutions for 3D
• Photonics Integration
• Sustainability
• Applications Enabled by 3D