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Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.
Speaking of retreating from ESG, OPEC called for more oil and gas investment as Russia and Saudi Arabia doubled down on what they believe to be continued growth in fossil fuel-driven energy through 2050. Meanwhile, the clock is ticking as the 90-day tariff “truce” with China is due to expire in three weeks. Stay tuned!
We published the second edition of the Advanced Electronics Packaging Digest (AEPD) on Monday. (Don’t forget to subscribe to continue receiving it!) My Editor’s Choice is a feature from the AEPD, which details the evolution in interconnect that has led to substrates and interposers taking on more PCB-like qualities. I’m also highlighting the first episode in a new I-Connect007 podcast series, “Voices of the Industry.” This first episode highlights KOKI’s advanced printing technology. Innovation in materials used in manufacturing is certainly not relegated to laminate and substrates.
While we’re on the topic of advanced manufacturing, we have an article by Virginia Hogan of Dymax, who focuses on light-curable solutions for adhesives and coatings intended for the intensity of space environments.
Jesse Vaughan of Summit Interconnect explains the accelerated importance of prototype manufacturing in defense electronics in light of the rapid innovation and manufacturing to scale now required—consider the Ukraine-Russia conflict and the overwhelming quantity of drones used and still needed. Lastly, we are at the beginning of the 2025–26 trade show and conference season, so I have featured my review of SEMICON West 2025, which I attended last week in Phoenix.
I hope you have had a good week!
Interposers, Substrates, and Advanced Manufacturing
Published October 13
In our second issue of the Advanced Electronics Packaging Digest (AEPD), we feature a handy article that explains the development of substrates and interposers. We also discuss how substrates and interposers are becoming increasingly important as advanced packaging solutions are developed at the chip and system levels. Stay tuned for the second article in this short series in November’s AEPD. If you have not yet subscribed, please subscribe here, because you will stop receiving them in December/January if you have not opted in.
Light-curable Solutions for Reliable Electronics in Space Applications
Published October 15
With the emergence of well-known private companies such as SpaceX and Blue Origin, we are hearing more these days about low-earth orbit satellites (LEO). As mentioned previously, the world of advanced materials goes beyond the laminate and substrates being used to build PCBs and electronic systems. Advancements are also required in essential materials like fluxes, coatings, and adhesives that must withstand the rigors of ruggedized environments, such as space. In this article, Dymax’s Virginia Hogan discusses light-curable solutions for reliability in this realm. It is a solid discussion on the relevant reliability concerns of manufacturers and how these specific products address some key issues, such as outgassing, ionic contamination, and ionic residue.
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Published October 14
Jesse Vaughan of Summit Interconnect dispenses some wisdom on the critical importance of early engagement. Getting “to market” faster is more important than ever in every sector of electronics, but there is no sector with more harrowing potential consequences than defense. “More innovation, faster” is a familiar refrain I heard repeatedly over the past two weeks at three different industry events, all with very different focuses. Jesse guides the reader through the current trends in modern prototyping and discusses the importance of striking a balance between speed and reliability. I recommend this read for everyone, whether you are working in defense or not.
SEMICON West: The Path to a $1 Trillion Future
Published October 14
Last week, I had the pleasure of attending SEMICON West in my hometown of Phoenix. The show’s theme was “The Path to $1T: Shaping a Sustainable Future in Talent, Technology, and Trade.” It was the largest SEMICON West in recent memory, boasting 50% growth in exhibitors and 60% growth in attendees YOY, based on early registrations, and the biggest show I’ve attended at the Phoenix Convention Center. Arizona has been unofficially crowned “the semiconductor capital of the United States,” with Intel and TSMC investing in the U.S. semiconductor foundry and manufacturing infrastructure. Check out my review of this must-attend event.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
Published October 13
In our new podcast series, “Voices of the Industry,” we spotlight KOKI Solder America, particularly solder’s importance in assembly. KOKI is crack-free and (truly) zero-residue fluxes is noteworthy. Click on the link above to learn about this dynamic new podcast series and access our KOKI interview.
