Winners of IPC Hand Soldering Competition at InnoElectro 2023 Announced
April 5, 2023 | IPCEstimated reading time: 1 minute
IPC hosted a Hand Soldering Competition in Budapest, Hungary, at InnoElectro March 28-30, welcoming 42 competitors from 29 European electronics companies. Skilled contestants competed to build an assembly in accordance with IPC-A-610, Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process, and overall product quality. Contestants were allowed a maximum of one hour to complete the process.
Taking top honors this year were:
- In first place for the second consecutive year, Peter Zsombok, BHE Bonn Hungary KFT, scored 538 points out of a maximum possible 558. Zsombok will compete for the World Championship title in November at productronica in Munich.
- Second place: Viktor Czonka, Alpine Hungary, with a score of 535 out of 558.
- Third place: Janos Szebelledi, BHE Bonn Hungary KFT, with a score of 529 out of 558.
This year’s Best Company Team trophy was presented to BHE Bonn Hungary KFT, for a combined score of 1028, achieved by team members Peter Zsombok and Janos Szebelledi.
IPC is grateful to the HSC sponsors for their generous support:
- Gold sponsors: Weller Tools, Thales
- Silver Sponsors: Almit, Ateliers Systems, NCAB Group, Optilia, Polygone CAO, SFM-Societe Française de Microscopie
“IPC thanks and congratulates all the participants and their companies for their interest and for taking up the hand soldering competition challenge,” said Philippe Leonard, IPC Europe director. “The competition board was very complex this year, and the contestants rose to the challenge with amazing performances. We look forward to more exciting competitions this year, ending with the World Championship at productronica in Munich.”
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswireBoard-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional test, with upstream wafer, sort, and final test data remains difficult, particularly in photonics, advanced packaging, and high-density integration environments.
Altus Announces Return of ‘Factory of the Future’ for 2026
05/11/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced the return of its ‘Factory of the Future’ event for 2026.
Kopin Secures $21.5M Follow-On Contract for U.S.-Made Thermal Imaging Assemblies
05/06/2026 | BUSINESS WIREKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, announced it has been awarded a $21.5 million follow‑on production contract to manufacture a custom thermal‑imaging eyepiece assembly for a major U.S. defense prime contractor.
Kopin Wins $21.5M Follow-on Contract for U.S.-Made Thermal Imaging Assemblies for Defense Prime
05/05/2026 | PRNewswireKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, enterprise, industrial, consumer and medical products, announced it has been awarded a $21.5 million follow‑on production contract to manufacture a custom thermal‑imaging eyepiece assembly for a major U.S. defense prime contractor.
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
05/05/2026 | TrendForceGlobal shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.