-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Kyocera to Acquire Construction Site in Japan for New Smart Factory
April 5, 2023 | Business WireEstimated reading time: 1 minute

Kyocera Corporation announced that it has reached an agreement to acquire about 37 acres of land for a new smart factory at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture. A signing ceremony held at New Nagasaki Hotel was attended by Kyocera Corporation President Hideo Tanimoto, as well as Kengo Oishi, Governor of Nagasaki Prefecture, and Yukishige Okubo, Mayor of Isahaya City.
Kyocera, which is reinvesting in its existing factories both in Japan and abroad, decided to build the new plant in December 2022 after determining that rising market demand will require additional production capabilities. The land purchase agreement includes a developed site of about 14 acres, where construction will begin in October 2023, and another 23-acre pre-developed site that Kyocera plans to acquire in 2024.
In the electronics industry, demand for components is expected to keep rising alongside such trends as miniaturization, advancing semiconductor technology, the growing functionality of smartphones and other communications devices, the expansion of 5G base stations and data centers, and the proliferation of new automotive innovations including ADAS (advanced driver assistance systems) and EV (electric vehicle) technologies.
To meet this demand, Kyocera is designing the new factory to produce fine ceramic components used in semiconductor-related applications as well as semiconductor packages, aiming for it to begin production in 2026.
Kyocera will continue developing its business to contribute to the local community by revitalizing the economy of Nagasaki Prefecture and creating new employment opportunities.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
SEMI Reports Global Semiconductor Equipment Billings Increased 24% Year-Over-Year in Q2 2025
09/05/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 24% year-over-year to US$33.07 billion in the second quarter of 2025.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.