Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Indium Corporation’s Jenny Gallery to Present at HiTEC
April 5, 2023 | Indium CorporationEstimated reading time: 2 minutes
Indium Corporation’s senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico. The presentation, scheduled for April 20, will cover the findings from a technical paper titled AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications.
80Au20Sn is a great choice to ensure good performance and reliability for the plethora of applications that require a high-melting die-attach solder, especially when used in one of its most highly demanded applications: semiconductor laser die-attach. However, the widespread use of semiconductor lasers has been prevented due to the difficulty managing thermal heat transfer. The longevity and potential of these devices become limited when the operational heat increases. One option to improve thermal transfer is the use of a thinner 80Au20Sn preform in the bondline, which allows the heat to transfer to the heat-sink more quickly and efficiently. Defining the voiding percentages for several 80Au20Sn preform thicknesses—ranging from 0.002” to 0.00035” thick—allows for conclusions to be drawn on 80Au20Sn preform thickness’s effect on thermal management in semiconductor laser applications.
“At Indium Corporation, we are constantly improving and expanding our capabilities and the development of an innovative material such as the AuLTRA™ ThInFORMS™—a product that is four times thinner than the average human hair—embodies that core value. In addition to being able to manufacture such a product, generating the data to support its unique qualities authenticates our dependability as a solder materials supplier,” said Gallery. “The opportunity to educate others in the field of electrical and electronic manufacturing on this new technology is a great privilege and I would like to thank IMAPS for giving me the platform to share my expertise at HiTEC.”
As a senior product specialist for the high-temperature business, Gallery is responsible for driving and supporting precious metal-based sales activity and revenue growth by identifying regional market opportunities, leading product and process support, facilitating relationships and driving new business development in the field. She also provides product and process support for solder preforms, wire, ribbon, and paste. Gallery earned her bachelor’s degree in chemistry at the University at Albany. She has past experience as a Pharmaceutical Scientist in the clinical and non-clinical research industry, is certified in TEFL (Teaching English as a Foreign Language), and is also a Certified SMT Process Engineer (CSMTPE).
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.