Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
MacDermid Alpha to Exhibit at Productronica China 2023
April 6, 2023 | MacDermid AlphaEstimated reading time: 1 minute
MacDermid Alpha, one of the world’s largest providers of solutions for circuitry, assembly, and semiconductor manufacturers within the electronics industry, will be participating at Productronica China, April 13-15, 2023, at the Shanghai New International Exhibition Center (SNIEC) Shanghai. Visitors are welcome to booth 4528, Hall 4 to speak to our team of experts.
MacDermid Alpha will showcase its integrated solutions for circuit board assembly, including high-reliability solder pastes combined with compatible reinforcement and protective polymers. Additionally, materials and processes for die, package, and top attach will feature which are of particular importance for the expanding Chinese power electronics industry.
Ensuring board level reliability is critical as the demands for performance and longevity increase, especially in harsh end-use environments, such as automotive, 5G, and infrastructure. MacDermid Alpha will feature assembly materials, including the ALPHA CVP-390V and OM-565 HRL3 high-performance solder pastes which when combined with its ALPHA HiTech® reinforcement and Electrolube protective polymers can provide exponentially improved performance and reliability. MacDermid Alpha has rigorously tested these products in combination to provide the optimum materials for the end-use application.
Additionally, MacDermid Alpha offers a complete product offering for semiconductor assembly focusing on range, power, and reliability. The Argomax® portfolio is renowned for its ability to be sintered at lower pressures than some competitor brands, leading to a leaner, more cost-effective in-line process. Argomax®2148, the latest product offering is a sinter paste engineered for low-pressure processing and offers the additional bonus of being suitable for contaminated heat sink surfaces.
MacDermid Alpha is powering the future of circuit board assembly and semiconductor assembly solutions, developing products to meet the ever-changing requirements and standards for the automotive, communication, and power industries. Let’s start a conversation in Hall N4 booth 4528. The MacDermid Alpha team looks forward to meeting you to discuss how to elevate your process with an integrated ‘start to finish’ roadmap featuring some of the most advanced technologies on the market, backed by extensive R&D facilities, a secure supply chain, and extraordinary customer service. Established brands aligned under MacDermid Alpha Electronics Solutions include Alpha®, Compugraphics, Electrolube®, Kester®, and MacDermid Enthone®.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.