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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Zollner Puts New Mechanics Building into Operation

06/19/2026 | Zollner Elektronik AG
With the commissioning of the new mechanics building at the main Zollner location in Zandt, Zollner Elektronik AG is setting another milestone in the further development of its manufacturing and service competencies.

Mycronic Receives Order for an SLX Mask Writer

06/19/2026 | Mycronic
Mycronic AB has received an order for an SLX mask writer from a new customer in Europe. The order value is in the range of USD 6-8 million. Delivery of the system is planned for the third quarter of 2026.

Jabil Expands Manufacturing Capacity in India

06/19/2026 | BUSINESS WIRE
Jabil Inc., a global leader in engineering, supply chain, and manufacturing solutions, announced the opening of a new factory in Pune, marking a significant expansion of the company’s India manufacturing capacity.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/19/2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.

MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste

06/18/2026 | MacDermid Alpha Electronics Solutions
With silver price volatility increasing and sustainability requirements accelerating across semiconductor assembly, MacDermid Alpha Electronics Solutions introduces ATROX® CD 560-1, a zero per- and polyfluoroalkyl substances (PFAS) alternate silver filler die attach paste designed for metal leadframe packages and high-speed automated dispensing in modern manufacturing environments.
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