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Silicon Mountain’s Annual Multi-Million Placement Accuracy Statistics for First Pass Yield Continue to Grow
April 6, 2023 | Silicon MountainEstimated reading time: 1 minute

Silicon Mountain, a leading electronic manufacturing company, announced that its annual multi-million placement accuracy statistics for first pass yield continue to grow. The company uses surface mount technology (SMT) machines, including the award-winning Fuzion and Advantis Platforms from Universal Instruments. These machines offer the latest, innovative technology in SMT. They enable Silicon Mountain to print, place, and reflow components in a variety of sizes from <0201 to 44 mm.
“We started Silicon Mountain 20 years ago to give OEMs the option to run high-volume electronic assemblies in the United States,” stated Kris Townsend, President of Silicon Mountain. “Our SMT growth is a testament to our unwavering commitment to innovation, excellence, and customer satisfaction.”
The Advantis3™ combines the best in technology, performance, and unmatched scalability. The Advantis3™ machines are the little brother to the Fuzion® machines, running single 30 spindle Lightning heads. Upgraded with new style spindles for increased accuracy, they add flexibility and speed to Silicon Mountain’s placement lines. These machines feature powerful, flexible platforms that handle a range of applications and readily adapt to new ones.
The Universal Fuzion® platform line of equipment consists of high-speed pick-and-place machines. They use a vacuum system in conjunction with spindles and nozzles for high-speed precision placement of components on circuit boards. Fuzion uses a variety of nozzle sizes and types to pick a range of SMT electronic components from numerous feeder types and place them on a circuit board. The fiducial correction system is capable of reading fiducials from multiple circuits on a board for pinpoint accuracy.
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Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
20 Years of Center Nanoelectronic Technologies (CNT) – Backbone of German Semiconductor Research Celebrates Anniversary
08/14/2025 | Fraunhofer IPMSThe Center Nanoelectronic Technologies (CNT) of the Fraunhofer Institute for Photonic Microsystems (IPMS) is celebrating its 20th anniversary this year. Since its founding in 2005, it has developed into a pillar of applied semiconductor research in Germany and Europe. With its unique research cleanroom and equipment adhering to the 300-mm wafer industry standard, CNT is unparalleled in Germany and serves as a central innovation driver for the microelectronics industry.