-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Dymax Reveals MD 1045-M Multipurpose Adhesive for Prefilled Syringes & Injection Devices
April 7, 2023 | DymaxEstimated reading time: Less than a minute

Dymax, a leading manufacturer of rapid-curing materials and equipment, is pleased to announce the release of 1045-M adhesive, the newest product in its renowned line of MD light-curable materials for medical device assembly.
The product is designed to bond the glass, SS, ABS, and PC substrates used to assemble prefilled syringes, single-use devices, and auto, pen, and wearable injectors. MD® 1045-M adhesive is formulated to solve the challenges associated with needle orientation, material overflow, and long cure times of other technologies.
The low extractables material passes ISO 10993 cytotoxicity testing and meets essential biocompatibility standards for medical device applications. It is intended to help manufacturers increase productivity, reduce processing times, and exceed critical pull force and quality requirements.
Dymax MD® 1045-M is one-part, solvent-free, and 100% solids for an eco-friendly alternative to solvent-based adhesives. In addition, the product’s low 475 centipoise viscosity flows easily onto components in 10 seconds versus the current 30+ second standard. The material also cures tack-free with UV/Broad Spectrum light and is LED-curable at 365 nm in 5 seconds for faster, environmentally friendly processing.
This low-shrinkage adhesive exhibits a glass-like cure surface, resists yellowing, and withstands autoclave cleaning and Gamma and ETO sterilization methods.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
KYZEN to Provide Solutions to Drive Reliability at the Battery Show
09/26/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The Battery Show North America from Oct. 6-9 at Huntington Place in Detroit, MI.
KYZEN Partners with LPW to Elevate High Purity Cleaning with Cutting-Edge Cyclic Nucleation Technology in North America
08/13/2025 | KYZEN'KYZEN, a global leader in advanced cleaning solutions, has reached a major milestone in high-purity cleaning with the addition of a state-of-the-art Vacuum Cyclic Nucleation System at its North American Application Lab.
KYZEN to Feature CYBERSOLV 141-K and KYZEN E5631J at SMTA Michigan Expo and Tech Forum
08/05/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Michigan Expo and Tech Forum, scheduled to take place Tuesday, August 19, 2025 at Laurel Manor in Livonia, Michigan. During the event, the KYZEN Clean Team will highlight precision aerosol cleaner CYBERSOLV 141-K and understencil cleaner KYZEN E5631J.
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.