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Cleaning Systems for a Range of Manufacturing Needs from PBT Works at SMTconnect 2023
April 10, 2023 | PBT WorksEstimated reading time: 1 minute

PBT Works s.r.o., a leading manufacturer of cleaning technology for electronic assemblies and tooling, and its German distributor factronix GmbH will exhibit in two stands (Hall 4A, Stand 110 and Hall 4A, Stand 207) at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The team will showcase a range of cleaning systems for different manufacturing needs, including the HyperSWASH PCB cleaning system, HyperCLEAN maintenance cleaning system, MiniSWASH stencil cleaner and Go23 stencil printer.
PBT Works will showcase the flexible HyperSWASH that covers a wide assortment of needs – cleaning the most challenging assemblies with the largest BGAs and QFNs. The cleaner features an automated pushcart docking system, pushcart transloader for loading/unloading and customized MES connectivity.
Also on display, HyperCLEAN is a high-capacity flexible maintenance cleaning system that is compatible with all of the latest automation. Ideal for high throughput, handling of numerous or heavy objects is now easier using the included pushcart. HyperCLEAN is ideal for high-volume cleaning of large size solder pallets, SMT oven filters and other mechanical parts.
The MiniSWASH stencil cleaner is a budget-friendly system designed for small and medium manufacturers. The cleaner can handle stencil, squeegee, and misprinted PCB cleaning all in one system. The ideal solution for smaller capacity automated cleaning, the MiniSWASH’s integrated slide-in stencil clamping system can be easily adjusted for any size SMD stencil.
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Sweeney Ng - CEE PCBSuggested Items
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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
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